United States
Write a Review
Welcome to Advanced Techniques US, Inc.
Manufacturer / Exporter / Supplier Of AT-GDP BGA PLACEMENT STATIONS, PRO 1600 SMT REFLOW OVENS, AT-DB FLIP CHIP DIE BONDER, PRO 1600-RS REFLOW SIMULATOR, CAT 90-SA SMT PICK SYSTEMS
Year of Establishment
1986
Primary Business
Supplier
Number of Employees
10-49
The AT-GDP SMD BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, PoP, Wafer Level Dies, and many other SMD’s are processed with consistently high quality results. Precise mechanics and advanced software simplifies component placement, soldering, andor rework. Operator involvement is very limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality. Solid design enables ultra precise placement to within 0.0002" or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle even the smallest and fragile devices along with complex packages like stacked dies or Package-On-Package (PoP). Split Vision Optics allows simultaneous top of the PCB substrate and bottom of the component viewing to superimpose and align both images. Split Imaging is a feature that creates diagonal corner viewing for alignment of larger packages at high magnification. High quality components within the optics system ensure a clear and distortion free imaging. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked. An Automated Profile Generation feature allows the user to develop an optimum profile in a single pass that may be saved for future processing. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controls reflow via forced air nitrogen convection top heater, forced air convection localized bottom heater, and a large area Quartz IR preheater. Airflow at the top heater is monitored by the software and delivers excellent temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components like 01005 passives. Controlled cooling of the part and PCB is accomplished via direct air nitrogen flow at the top nozzle, air flow at the localized bottom heater, and large area underside board cooling. For high value reliability assemblies such as in Aerospace, Military, and Medical applications requiring superior quality solder joints, Nitrogen gas may be purged through the top heater as a substitute for air. Numerous industry studies have shown that soldering in a Nitrogen atmosphere yields stronger, higher quality solder joints when compared to soldering using air or IR sources. This is primarily due to reduction and elimination (when reaching low levels of Oxygen) of oxidation at the bond site. It is especially the case with fine pitch devices where solder paste or flux volume at the pad site is minimal and burns off quickly at higher temperatures. Once flux burns off, good wetting cannot be achieved and results in cold, intermittent solder joint connections. If reflowed in Nitrogen, even with flux burned off, the blanket of Nitrogen gas will prevent pads and solder bumps from oxidizing. The result is good wetting and ultimately strong quality solder joints. Benefits of soldering in Nitrogen is also documented when processing multi-layer, high thermal mass assemblies especially those with solid ground planes. As the process window is extended due to longer heating times, solder pastes' flux burns off and the same poor wetting is observed in coarse pitch as with fine pitch devices. Purging Nitrogen at the top heater extends the process window and allows achieving quality solder joints even if the cycle is considerably longer due to the assemblies heavy thermal mass. Like other machines that our company has been producing for over the past 30 years, AT-GDP was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-GDP series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D Engineering departments to production environments typical of volume repair centers.
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes. Precise mechanics and advanced software simplifies the optical alignment, placement, and bonding stages of the process. Operator involvement is limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality. Solid design enables ultra precise placement of flip chips and dies to within 0.0002" or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle fragile dies down to 0.2mm x 0.2mm. Alignment is performed using split vision optics allowing simultaneous view of the substrate and flip chip die. The two images are superimposed using micrometers on a precision vacuum locking stage. Software contains a database of predefined profiles which the user selects based on the die and substare. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controlled heating at the die is performed via a convection Air Nitrogen heater. Substrate can be heated via a conductive as well as a convective stage heaters. Critical process parameters like bonding force, heating ramp up rates, temperatures, dwell times, gas flow, and cooling rates are monitored by the software to deliver consistent quality. Like other machines that our company has been producing for past 30 years, AT-DB was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-DB series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D, NPI, Engineering, and batch production environments.
PRO 1600 is a full forced air nitrogen convection reflow oven with only a 31" x 31" footprint of floor space. It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, and ceramic assemblies. PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsiussecond from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels. Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.
PRO 1600-RS is specifically configured for reflow simulation, package qualification, and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113G standard, Moisture Sensitivity Level (MSL) testing of packages per IPC JEDEC J-STD-020E, and thermal stress testings as performed by PCB fabricators to IPC-TM-650 Test Method 2.6.27 IPC-9631 standards. Instead of performing reflows in an inline tunnel oven which typically range 12 ft. - 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31" x 31". All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. For board coupon reflow, tests require 6X or more until failure is detected. Therefore, automating the process not only eliminates operator involvement in tracking and handling each pass, but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in papers titled Automating Preconditioning and Package Qualification Reflow Cycles and Automating Thermal Stress Reflow Simulation on PCB's A proprietary design allows achieving temperature ramp up rates of up to 4° Celsiussecond from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Contact us and discover why some of the leading semiconductor and printed circuit fabrication companies prefer PRO 1600-RS reflow simulator for their preconditioning, package qualification, and thermal stress testing needs.
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC�s, fine-pitch QFP�s, and many other SMD�s. Software control ensures error free pick and place sequences on the assembly. This is a critical feature that greatly reduces debugging of prototype assemblies. High productivity is achieved by eliminating the need to refer to a PCB layout schematic diagram as with manual machines. Software guides the operator to pick up an appropriate component from a specific bin (handles loose parts) or feeders and then displays the corresponding placement location on a virtual PCB. The operator simply moves the placement arm along X and Y axis� while as necessary, referring to the camera monitor for a magnified view. To place fine pitch components, the camera may be rotated to view all 4 sides of a component. With the placement arm automatically locked in place, X and Y micrometers of a positioning stage, along with Theta rotation are used to provide necessary fine adjustments for component positioning. The software also allows an unlimited number of feeders and carousels that may be programmed for each assembly. Both feeders and the carousel are interchangeable in mid assembly within a matter of seconds. In comparison to manual pick and place systems, CAT90-SA delivers higher productivity (up to 1, 000 CPH), eliminates placement errors, and greatly reduces operator fatigue. On the flip side, fully automatic pick and place systems require expensive feeders, are time consuming to program, and are unable to place loose parts. The overall cost of owning and operating an automatic system is typically not efficient for prototype and low volume assembly requirements. This makes the CAT90-SA a very attractive and cost effective solution for prototype and small volume assembly requiring.
Share your thoughts with other customers for Advanced Techniques US, Inc.
Add Review
(Advanced Techniques US, Inc.)Warminster, PA 18974 map, United States
Share us via
