American Semiconductor Inc

The FleXform-ADC is the world's first complete development kit for flexible hybrid electronics. The FleXform-ADC is designed for developing and prototyping printed andor flexible sensors integrated with physically flexible FleX-ICs. The FleXform-ADC provides: "Out-of-the-box" proof of FHE feasibility User printable area with on-board FleX-ADC™ Integration Board and Software Enables printed device demonstration Fully supported by American Semiconductor's flexible technology integration team for design and manufacturing

FleX-ICs: Silicon-on-Polymer Products FleX™ Silicon-on-Polymer™ is a revolutionary process for creating high-performance, single-crystalline CMOS with multi-layer metal interconnect on a flexible substrate. FleX enables a new generation of durable, pliable ICs that greatly improves the ability to integrate CMOS functionality in flexible electronics. FleX delivers fully functional, flexible wafers with a final silicon thickness as thin as 2000Å (angstroms). FleX can be applied to SOI processes from any foundry. FleX allows post thinning fab processing, enabling new capabilities for packaging and 3DIC integration. FleX has been demonstrated both at the wafer scale as well as conformally mounted to an irregular surface. Test results of the same die as a full-thickness wafer and as a FleX wafer show little electrical shift with some parameters actually improving.

American Semiconductor's GP-Tag represents the leading edge of new smart label technology. This wireless sensor tag has the look, feel and application characteristics of a conventional small shipping label. The difference is that this tag can report the temperature of the environment it experiences. The passive tag has no battery requirement and the wireless capability of the tag allows reporting temperatures inside of a shipping container without requiring the container to be opened. The tag can be also be used as an integral part of data collection for product quality. The tag requires RFID readers that can provide sufficient power for the temperature sensing functions in addition to the write and read commands that are typical of Class1Gen2 RFID tags. Low-cost full-size readers and portable hand-held readers are currently available for this tag. Applications and support for readingplotting temperature data are available for Android and Windows platforms RFID Temperature Sensor label UHF (902-928 MHz) Passive Power (from reader) EPC Gen 2 (ISO 18000-6C) -40'C to 60C +- 2'C ~8ft Range 4" x 1" LabelSize