The Nokota system expands the Applied Materials suite of electrochemical deposition systems with a high-productivity wafer-level packaging tool that delivers best-in-class performance for the full range of plating steps used in diverse packaging schemes. These range from flip chip and wafer-level chip-scale packages to 2D and 3D fan-out, 2.5D interposer designs, and through-silicon via. Systems are available for 150mm, 200mm, and 300mm operation, and for simultaneous processing of 150mm200mm and 200mm300mm wafers. Copper, tinsilver alloy, nickel, gold, tin, and palladium are the metals most commonly used, although others can be accommodated.