Our Products #4939997

RO3000 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.

Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks. This approach overcomes voiding and flow issues that can be problematic for sweat soldering and dispensed adhesive approaches. The films can be tack soldered in a fixture ensuing accurate registration followed by a tooled thermal cure or typical PCB press cycle.

Kappa 438 thermoset laminates were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates. These laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxyglass (FR-4) processes.

92ML Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics for multilayer PWB's for applications requiring thermal management throughout the entire board volume. ML Series laminates are also offered in combination with a metal plate as a mechanical chassis and integral heat sink.

AD series PTFEwoven glass based laminates are designed for cost sensitive commercial applications and deliver consistent, high performance required of high frequency PCB materials. This product series is offered with a dielectric constant range from 2.5 to 10.2, with loss tangent values ranging from 0.0014 to 0.003 @ 10GHz. This offers designers a broad range of products to meet demanding requirements for a variety of designs.

Industry leading RO4000 hydrocarbon ceramic laminates and prepregs offer superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxyglass (FR-4) processes.

CLTE series products are woven-glassPTFEmicrodispersed ceramic composite laminates. CLTE Series materials offer stable electrical performance over temperature, critical for phase sensitive applications. Woven glass matrix provides excellent dimensional stability; ideal for thin core, multi-layer boards; highest degree of embedded resistor consistency in the industry. Low CTE values ideal for high reliability plated through holes for Avionics, Radars, EW, SIGINT, CNI (Communications, Navigation, Identification), and Phase Sensitive Filters.

DiClad laminates are Fiberglass Reinforced PTFE-based composites for use in High Frequency Applications as printed circuit board substrates. Controlled Fiberglass and PTFE content and ratio enable DiClad laminates to offer a range of low dielectric constant values. The lowest dielectric constant and loss tangent are achieved with higher relative PTFE content, while a higher ratio of fiberglass reinforcement provides better dimensional stability and registration.

CuClad and IsoClad laminates are Fiberglass Reinforced PTFE-based composites for use in High Frequency Applications as Printed circuit board substrates and Radomes. CuClad laminates use woven fiberglass while IsoClad laminates use non-woven fiberglass as reinforcement.

2929 Bondply is an unreinforced, thermoset based thin film (available in 1.5, 2, and 3 mil) adhesive system intended for use in high performance, high reliability multi-layer constructions. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer blind via fill capability.