Manufacturer / Exporter / Supplier Of piloted aircraft, thermal management, IGBT Baseplates, semiconductor packaging, Automotive, Engine Components
Year of Establishment
1989
Primary Business
Supplier
Number of Employees
200-499
The Centaur is an optionally piloted aircraft (OPA) that has benefited from Aurora’s 26 years of experience in advanced aerospace systems and autonomy. The Centaur combines the best of manned and unmanned aircraft capabilities boasting three modes of operation (manned, unmanned and augmented).Centaur is an excellent solution for operations over controlled airspace, utilizing the high degree of safety and redundancy required for manned aircraft, with the payload capacity and flexibility of a large unmanned systemCentaur can be operated from a remote ground control station, which can conveniently ferry onboard, enabling high mobility of the entire system. Both pilot and sensor operator stations can be staged onboard or remotely, allowing for a variety of flight configurations designed to meet multiple needs including long endurance, hazardous operating environments and the highest level of safety and reliability.
Insulated Gate Bipolar Transistors (IGBT) offer excellent switching efficiency for high power electronic components. Applications include Hybrid or Electric Vehicles (HEV EV), traction motor controls, and inverters for switch-mode power supplies in Alternative Energy, Uninterruptible Power Supply (UPS) and welding. MC-21 Al-SiC MMC provides lightweight, high reliability solutions for thermal management of these devices with high thermal conductivity and low coefficient of thermal expansion (CTE). The unique properties of MC-21 MMC allows for a cost effective alternative BETWEEN copper and high-priced, traditional Al-SiC. MC-21's unique products and processes allow for value added solutions to your thermal management needs. Better reliability than Copper or Aluminum Lighter weight than Copper Much stiffer than Aluminum or Copper Excellent wear and corrosion resistance Cheaper than traditional Al-SiC producers High volume production capability
MC-21's Aluminum Silicon Carbide Metal Matrix Composite (Al-SiC MMC) is the next generation in thermal management material. With thermal conductivity equivalent to aluminum, MC-21 MMC can be tailored to match copper's coefficient of thermal expansion or reduce it by up to 40%. Unlike the traditional Al-SiC suppliers, our MMC is produced by using many of the same high volume, low cost processes used by aluminum and copper producers. By stamping sheet or squeeze casting into molds, we can tailor your heat spreader at half the cost of other MMC suppliers. Unlike the traditional Al-SiC suppliers, our MMC is produced by using many of the same high volume, low cost processes used by aluminum and copper producers. By stamping sheet or squeeze casting into molds, we can tailor your heat spreader at half the cost of other MMC suppliers. MMC45, MC-21's latest innovation, takes CTE to the lowest level possible in Stir-Casting...approaching 10 ppmC. Contact MC-21 for further information on this unique material.
MC-21 Al-SiC MMC allows engine designers to replace iron and steel with aluminum-based MMC formulations by using Al-SiC where ordinary aluminum just doesn't stand up. Whether as connecting rods, cylinder liners, bed plates or housings, MC-21 offers a variety of materials that can be cast to near net shape cost efficiently.
The exceptional wear resistance and thermal conductivity of MC-21's metal matrix composite makes it a prime candidate for light-weighting today's vehicles. The largest impact in lightweighing is unsprung weight. Replacing iron or steel brake rotors with MMC can result in as much as 50% reduction in unsprung mass.
Packaging designs continue to evolve and thermal management must evolve with it. MC-21's rolled and stamped MMC's provide the best value in Flip Chip lids and stiffeners. With low CTE and good thermal conductivity, MC-21's MMC30 material is a much more cost-effective solution than other traditional Al-SiC suppliers. MC-21's Al-SiC MMC can be cast into complex designs which could eliminate a Thermal Interface Material (TIM) layer. Our MMC30 with a CTE of 14.5 ppmC or MMC45 with a CTE of 10.5 ppmC can integrate the cavitypedestal features of a thermal spreader with the fins of a heat sink to eliminate the TIM 2 layer in microelectronic packaging, reducing thermal resistance and improving overall production costs, time and handling.
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