Austin Semiconductor Europe, Ltd.

CSPPlastic Packaging Micross is here to meet your application's demand for a smaller, more reliable packaged component with our chip scale packaging solutions. Chip scale packages offer near-die size footprints and reductions to package thickness and weight. A chip scale package combines the performance and size advantages of flip chip bare die and the reliability of an encapsulated device in one tiny package. Chip scale packaging is the ideal solution for battery powered small form factor devices such as wearablehand-held electronics, implantablenon-implantable medical devices, industrial sensors and a variety of military applications. Key Features Flexible tooling for custom packages Single die design typically 20% larger than die size 0.5mm pitch up to 1.27mm pitch Capable of package heights

Hermetic Packaging Hermetic Packaging Capabilities: Ceramic & Metal Can Ceramic 600 & 400 mil DIP SOJ Two-sided LCC Four-sided LCC Gull Wing QFP PGA Flat Pack Formed-leaded Flat Pack Metal Can flat-packs Micross has served the aerospace, space & defense high-reliability custom-assembly and test marketplace for more than 35 years. We’ve designed and produced a wide assortment of custom hermetic devices - from diodes to giga-bit 800 MHz memory devices. Many of those products address the high-reliability requirements and custom ceramic-packaging needs of the SATCOM and space community. Micross is registered under AS9100 in every one of our manufacturing sites and holds MIL-PRF-38534 Class H, MIL-PRF-38535 Class Q and MIL-PRF-38535 Class V (assembly) certifications. Our unwavering commitment to quality is one reason we are one of today’s leaders in custom packaging. If you have special requirements, we can work to modify standard specifications to suit your application.