Digital Matrix Corporation

• Length23 in.
• Depth32 in.
• Height74 in.
• Temperature Control+/-1 degree F/C
• Filter1- 20″ DOE 0.45 to 5 micron rated

One Plating Cell HighFlowFiltration (enhanced filtration yields fewer defects) Increased filtration speeds shim production Microprocessor controlled Remote diagnostics accessible by modem for services and diagnostics Faster production times Repeatability with uniform results Precise control of shim thickness and thickness variation Ergonomically designed Easy process maintenance

• Substratesup to 200 mm round wafers, up to 200 mm height square or rectangular
• Dimensions580 x 815 x 1230 mm (W x D x H)
• Heating0.5 kW
• Pump1/6 HP
• Exhaust3-1/2 inch OD Pipe Connection

One Plating Cell HighFlowFiltration (enhanced filtration yields fewer defects) Increased filtration speeds shim production Microprocessor controlled Repeatability for uniform results Precise control of plating thickness and thickness variation Ergonomically designed Easy process maintenance