Interplex Sunbelt

United States

Interplex Industries' innovative solder bearing leads and flux bearing leads were developed to help overcome significant challenges in circuit assembly eliminating costly and secondary soldering operations. This Solder bearing and Flux bearing lead technology attaches a precise amount of solder and flux on each contact that can be easily reflowed and directed to the conductor pad without the addition of additional solder or flux. This process provides perfect solder joints every time, in one easy step eliminating common quality concerns such as bridging and wicking. Interplex offers these leads with a wide variety of solder types from a 6040 tinlead to a large assortment of lead free solder types.

Press-Fit Zones: 0.64mm & 0.8mm Industry standard .64mm, 1.5mm, 2.8mm, 6.3mm size terminal's are available Blade Sizes: Standard and Custom Available Tested for Operational Temperatures Up to 150°C Designed for High Speed Insertion Standard and High Performance Alloy Options Flexible Tooling for Low Cost Variations Interplex Sunbelt’s solderless press-fit terminals are available in 0.64mm and 0.80mm options and, depending on alloy selection, are qualified for automotive applications at 125°C and 150°C. Modular high-speed production dies allow for configuration of specific blade lengths and tip geometries to reduce product development cycles as well as cost. Flag terminals, tuning fork sockets, dual press-fit stacking pins and other specialty parts are also available.

Interplex’s solderless press-fit terminals are designed for demanding applications and are available on 0.64mm and 0.8mm thick terminals. Read more on Press Fit Pins. Compliant PinPress-Fit Modules Manufacturers utilize Press-Fit TerminalCompliant Terminal technology in a variety of modules. Interplex's Solderless, Press FitCompliant technology helps customers design in low-cost, high-quality products to meet robust requirements for new electronics applications. Read more on Press Fit Modules.

Interplex offers complete solutions from concept through development and into scalable high-volume production of electronic modules for almost any electronic packaging application. Interplex's network of engineers develop solutions that fit the manufacturing needs of our customers and then match up those needs with the best Interplex production facility. Today, Interplex continues to expand its technologies and capabilities from developing solutions for high-speed data and micro electronic packaging requirements to high-current, thermally efficient packaging for power generation and conversion in electronic modules' applications such as RF Power and Hybrid technologies. Interplex is always driven by the singular mission to deliver innovative solutions and services to our customers.