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Carrier Tape

A picture is worth a thousand words. Take a look at some of our design portfolio and contact us if you see something that you like.
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Barrier Closure Protection Products

You can rely on MaxiGrips barrier closure protection products in unpredictable environments. Our state-of-the-art barrier technology joining solutions are ideal for applications that must withstand extreme conditions. Our products keep what is inside an assembly protected from the environment and prevents undesired external elements that cause damage or contamination from entering.
We offer flat or horizontal plane closures (MaxiGrip) and top or vertical closures (U-MaxiGrip) that are re-sealable and practical.
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Flexible Protective Bags

  • series DB 3000
We are one of the pioneers in the development of ESD oriented plastics and laminates. We continue to maintain the ranking as a leading supplier of superior engineered moisture barrier bags and clean room packaging.
Drypack DB 3000 series is specifically designed to provide superior moisture vapor barrier yet fully transparent. This proprietary film lamination structure enables you to see through to the contents and perform barcode scanning.
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Wafer Packaging Systems

  • Size 150 mm to 300 mm.
Our wafer packaging systems product line is your cost effective solution to secure storage and transport of semiconductor wafers, ranges from 150 mm to 300 mm. Since 1999, our customers have enjoyed higher yields through a significant reduction in wafer breakage during storage, handling and transport between front end and back end sites.
Our horizontal canister boxes are engineered solutions designed for the secure storage and transport of up to 25 wafers within a single box. These solutions are particularly suited to robotic recognition and auto-handling equipment utilized within wafer packaging operations.
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Jedec Trays

  • Size 2.5 x 2.5 mm
We offer Jedec trays that reflect our relentless pursuit in design philosophy to combine the best of both worlds - maximum durability and light weight.
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Carrier Tape

Match Metal Technology (MMT) is our unique manufacturing capabilities, which combine proprietary automated high speed pocket embossing and hole punching equipment with precision embossing dies, deliver several advantages - such as consistent indexing hole pitch, low pocket dimension variation and uniform wall thickness.
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  • Jagdidsh Deshpande (ITW ECPS)
  • 95 Commerce Dr Somerset NJ, United States
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