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CHO-BOND 1035: CHO-BOND® 1035 is a silver-plated glass filled, one component conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer.

CHO-BOND 1029: CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1029 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). Low volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1029 a good choice for a variety of commercial and military applications. Curing of CHO-BOND 1029 can be achieved in as little as 30 minutes with heat to minimize equipment downtime and increase manufacturing throughput. CHO-BOND 1029 is supplied as a two component system, one part liquid and one part wet powder solid. For optimum mixing and material performance, the sand-like solid part should be added incrementally to the liquid part and mixed slowly over a 10 minute time period. For best adhesion results, CHO-BOND 1029 should be used in conjunction with CHO-SHIELD 1085 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.

Tecknit 0002:TECKNIT 0002 is a silver filled, one component conductive silicone, designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for TECKNIT 0002 is 0.005 inches (0.13 mm). In addition, TECKNIT0002 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (150 psi) is required. TECKNIT 0002’s moisture cure silicone polymer system allows it to cureto the touch in 2 hrs and provides a flexible and resilient conductive and environmental seal over a wide range of application temperatures. Care must be taken when using TECKNIT 0002 on sensitive ubstrates as a trace amount of acetic acid is emitted during cure which may damage electrical circuitry. Ventilation may also be required when using TECKNIT 0002 as the acetic acid released during cure emits a strong odor. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

CHO-BOND 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. CHO-BOND 584-29 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)), but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. The fine silver filler of CHO-BOND 584-29 make it a good material choice for precise application in and around tight spaces and electrical components. CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues. Curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.

CHO-BOND Primer 1085 & 1086: Parker Chomerics CHO-BOND primers 1085 and 1086 are air-drying liquid coatings used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates. The primers are moisture reactive and clear in color. CHO-BOND 1085 primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND 1029 adhesive. CHO-BOND 1086 primer is formulated for use with CHO-BOND 1016, 1030, 1035, 1038, 1075 electrically conductive adhesivessealants and CHOTHERM® 1641 thermal compound. Note that typically, the proper primer comes bundled as a “kit” with the CHO-BOND or CHO-THERM compound ordered. However, if extra primer is deemed necessary, then part numbers for just the primer are provide in the ordering information below

CHO-BOND 1075: CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer.