Materion Advanced Materials Group

The properties of Materion Performance Alloys' copper beryllium alloys provide many advantages in demanding automotive, commercial and industrial applications ranging from oil and gas downhole drilling tools and subsea wellhead components, to computer burn-in and test sockets (BiTS) as well as automotive wire harnesses and connectors.

MATERION is a world leader, supplying high-performance alloys that enhance new technologies. With technical expertise, global service and more than 300 different alloys, we can provide unique alloy solutions metallurgically tailored to meet specific performance requirements. Our composite metal solutions range from high-performance beryllium to copper alloys to non-beryllium alloys that far exceed the capabilities of materials traditionally available in the marketplace. Our composite metals enable new developments in technically demanding products in a wide range of markets, including aerospace, automotive, electronics, telecommunications, and mobile equipment, to name just a few.

Our uniform silver-based alloys are available in a variety of forms including strip, wire, thin foils and wide-width sheets. They can be used in a range of silver brazing processes including torch, furnace, vacuum and inert gas atmosphere. Consult our SilSeal® Comparative Chart of brazing materials for more technical information.

GETTER COMBO-LIDS™ - COMBINING GETTER TECHNOLOGY WITH COVER LID For high reliability applications, certain GaAs electronic devices, MEMS devices and other sensitive sensors must be hermetically packaged with a sealed cavity completely free of hydrogen or all gases. Hydrogen degrades the long term reliability of GaAs devices. Many MEMS devices require vacuum for proper performance.

Hermetic lids for every application designed to protect your heat sensitive electronics. We customize solder, plating & clad properties to your individual requirements. CONTACT MATERION! WHEN YOU NEED HIGHLY RELIABLE HERMETIC SEALING - WE'VE GOT YOU COVERED! THREE OF OUR CUSTOMZIED LIDS & SPECIFICATIONS Micro-Lids™ Designed for a microelectronic package with area 0.300 in or less Due to small size, capillary action pulls liquid solder to perimeter during reflow Base metal is Kovar or Alloy-42 for high performance A42 is plated with several layers, including 35-50 micro-inches of gold Highly corrosion resistant for maximum protection An economic cost alternative to our traditional Combo-Lid™, but with the same quality Seam Seal-Lids™ Known as an electroless Ni plated lid Base metal is Kovar or Alloy 42 for high performance A42 is plated with 50-200 micro inches of electroless nickel Highly corrosion resistant for maximum protection Vast tool library built to stamp lids in a variety of sizes and shapes Typical dimensions for standard lids range from .250” square to .060” square Solder Reflow-Lids™ A smaller lid composed with non-precious metal solders An economic cost alternative to our traditional Combo-Lid™, but with the same quality Typically used for lids that measure less than .200” X .200” Solder coverage controlled to the lid edge, so it easily passes gross leak tests Can be adjusted to accommodate lead-free solders

We produce braze alloys for microelectronic packaging and high temperature joining of vacuum electronic devices. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms including ribbon, wire, preforms and powder. Materion manufactures “ultra clean” braze alloys with base metals free of contamination that produce joints of high integrity and strength. Available in: Pure metals and alloys Precious metals and alloys Lead-free AuSn in 8020 and 7822 Variety of shapes - squares, rectangles, dish, washers, frames