Our Products #5222945

Al-SiC for use as metal substrate within Printed Circuit Board Assemblies or as base substrate in Printed ElectronicsMC-21 MMC30 panels canReduce the Coefficient of Thermal Expansion: aluminum alloys' CTE can range from 22 to 25 ppmC. Copper is typically 17.5 ppmC. MC-21's MMC 30 is low at 14 ppmC, 45% better than Al and 20% better than Cu.Leverage the high Stiffness characteristics to:Reduce the thickness of the metal without sacrificing rigidityIncrease the printed copper thickness without warpingImprove solder joint reliability with its low CTE as well as its high damping (low vibration) characteristics

Boron Carbide based MMCAdding an interesting dimension to MC-21's product portfolio, boron carbide (B4C) can be added to yield MMC sheet with neutron absorption characteristics required in the storage andor transportation of radioactive materials. Typical applications are storage components and casks. Boron carbide also provides the highest Specific Stiffness characteristics of all the MMC's. Contact us for more information.

Brake RotorsThe exceptional wear resistance and thermal conductivity of MC-21's metal matrix composite makes it a prime candidate for light-weighting today's vehicles. The largest impact in lightweighing is unsprung weight. Replacing iron or steel brake rotors with MMC can result in as much as 50% reduction in unsprung mass.

Key features of MC-21's Stir-Casting: porosity eliminateduniform distributionfull wetting of ceramic particlesno chemical interactionhigh volume productionlow manufacturing costs

Silicon Carbide based MMCThe most versatile product; MC-21's Al-SiC MMC offers not only structural improvements in strengthtoughness as well as abrasion resistance, it also provides excellent thermal properties, such as high thermal conductivity and low coefficient of thermal expansion (CTE). Current formulations range from low reinforcement levels such as 20% by volume to as high as 45%.

Alumina based MMCMC-21 utilizes various aluminum alloys together with alumina particulate reinforcement to provide higher strength and toughness products for your structural needs. Applications can range from armor to brake rotors. These products can be heat treated into T6 or other condition for even higher performance.

Semiconductor PackagingPackaging designs continue to evolve and thermal management must evolve with it. MC-21's rolled and stamped MMC's provide the best value in Flip Chip lids and stiffeners. With low CTE and good thermal conductivity, MC-21's MMC30 material is a much more cost-effective solution than other traditional Al-SiC suppliers. MC-21's Al-SiC MMC can be cast into complex designs which could eliminate a Thermal Interface Material (TIM) layer. Our MMC30 with a CTE of 14.5 ppmC or MMC45 with a CTE of 10.5 ppmC can integrate the cavitypedestal features of a thermal spreader with the fins of a heat sink to eliminate the TIM 2 layer in microelectronic packaging, reducing thermal resistance and improving overall production costs, time and handling.