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Al-SiC for use as metal substrate within Printed Circuit Board Assemblies or as base substrate in Printed Electronics MC-21 MMC30 panels can Reduce the Coefficient of Thermal Expansion: aluminum alloys' CTE can range from 22 to 25 ppmC. Copper is typically 17.5 ppmC. MC-21's MMC 30 is low at 14 ppmC, 45% better than Al and 20% better than Cu. Leverage the high Stiffness characteristics to: Reduce the thickness of the metal without sacrificing rigidity Increase the printed copper thickness without warping Improve solder joint reliability with its low CTE as well as its high damping (low vibration) characteristics
MC-21, Inc
