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Products
Density (g/cc)
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Sheet/Cast
2.80
Semiconductor PackagingPackaging designs continue to evolve and thermal management must evolve with it. MC-21's rolled and stamped MMC's provide the best value in Flip Chip lids and stiffeners. With low CTE and good thermal conductivity, MC-21's MMC30 material is a much more cost-effective solution than other traditional Al-SiC suppliers. MC-21's Al-SiC MMC can be cast into complex designs which could eliminate a Thermal Interface Material (TIM) layer. Our MMC30 with a CTE of 14.5 ppmC or MMC45 with a CTE of 10.5 ppmC can integrate the cavitypedestal features of a thermal spreader with the fins of a heat sink to eliminate the TIM 2 layer in microelectronic packaging, reducing thermal resistance and improving overall production costs, time and handling.