NiCoForm Inc.

ROCHESTER, United States

We achieve a high degree of polish on even the smallest (less than 2Fr) ID tip forming surfaces with excellent release properties. And by electroforming dies with a low but uniform wall thickness (down to .005�), we can significantly shorten heating and cooling cycles and increase throughput. Complex configurations including balloon ends, multiple lumen dies, calibrated through-holes and integrated elements such as guide pins and mounting hubs are all possible with our process.