3M Thermally Conductive Acrylic Interface Pads are high performance non-silicone based thermal pads. They are found in 3 different selections; 5570, 5589H, and 5590H. Due to their inherent softness, these acrylic thermal interface pads can decrease the load to integrated circuit chips during compression, while exhibiting good tack to many surfaces. Designed with filled acrylic polymer, its use is intended for non-silicone applications.
These thermal pads provide excellent conformability, while also providing gap filling properties, that is enhanced by its ability to be stacked in any combination to 20mm. Each type of material provides sligthly different properties.
5590H has the highest thermal conductivity, but is some what firmer.
5589H is the softest and the most conformable, but has less thermal performance.
5570 is more tacky, on both sides, the most conformabl and the lowest thermal conductivity.