Rogers Corporation Woodstock

2929 Bondply is an unreinforced, thermoset based thin film (available in 1.5, 2, and 3 mil) adhesive system intended for use in high performance, high reliability multi-layer constructions. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer blind via fill capability.

Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer. It is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric. 3001 bonding film is available in a thickness of 0.0015" (0.038mm), in continuous 12" (305mm) wide rolls, on standard 3" ID (inside diameter) cores.

COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatible Low flow during pressure cure Bonds RF PCBs to heat sinks, pallets and housings

CLTE-P™ Prepreg Bonding material is intended for use as an adhesive in multilayer circuit boards designed with PTFE-based Microwave Printed Circuit Laminates.CLTE-P Prepreg comprises woven fiberglass, coated with a proprietary, ceramic filled, fluoropolymer resin formulation. As received, the prepreg is approximately 0.0032" thickness. Final lamination thickness depends on several factors such as lamination pressure, circuit distribution and copper thickness. (Typical final thickness 0.0024” when properly bonded between flat surfaces)

Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks. This approach overcomes voiding and flow issues that can be problematic for sweat soldering and dispensed adhesive approaches. The films can be tack soldered in a fixture ensuing accurate registration followed by a tooled thermal cure or typical PCB press cycle.

92ML™ materials are thermally enhanced laminates and prepregs specifically engineered and manufactured to meet the demands of high power applications. These materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. 92ML materials are ideal for multilayer applications requiring thermal management throughout the entire board. The high thermal conductivity of up to 3.5 WmK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc.