Our Products #3565946

COOLSPAN Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatibleLow flow during pressure cureBonds RF PCBs to heat sinks, pallets and housings

Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks. This approach overcomes voiding and flow issues that can be problematic for sweat soldering and dispensed adhesive approaches. The films can be tack soldered in a fixture ensuing accurate registration followed by a tooled thermal cure or typical PCB press cycle.

XTduroid Copper Clad Laminates for Printed Circuit Boards used in harsh environments XTduroid laminates utilize PEEK (polyether ether ketone) based dielectric cores. XTduroid laminates are available with or without glass reinforcement. The glass reinforcement offers improved dimensional stability and tensile strength. XTduroid laminates are available in multiple thicknesses starting from 2mil (50m). These laminates can be used in flex-to-install and rigid or semi-rigid multilayer PCBs. The absence of adhesive enables thinner pure dielectric resulting in more robust performance. A selection of various copper claddings are available to meet the performance requirements of the application. These laminates provide excellent high frequency performance when utilizing low profile copper cladding. Both the dielectric constant and dissipation factor are stable over a wide range of temperature and frequencies. XTduroid laminates are used in applications exposed to harsh environments. Being PEEK based, XTduroid laminates provide stable performance in extreme temperatures (melt temperature 343C649F) in cyclic as well as in continuous operating conditions. PEEK also offers excellent chemical and radiation resistance.

AD series PTFEwoven glass based laminates are designed for cost sensitive commercial applications and deliver consistent, high performance required of high frequency PCB materials. This product series is offered with a dielectric constant range from 2.5 to 10.2, with loss tangent values ranging from 0.0014 to 0.003 @ 10GHz. This offers designers a broad range of products to meet demanding requirements for a variety of designs.

CLTE-P Prepreg Bonding material is intended for use as an adhesive in multilayer circuit boards designed with PTFE-based Microwave Printed Circuit Laminates.CLTE-P Prepreg comprises woven fiberglass, coated with a proprietary, ceramic filled, fluoropolymer resin formulation. As received, the prepreg is approximately 0.0032" thickness. Final lamination thickness depends on several factors such as lamination pressure, circuit distribution and copper thickness. (Typical final thickness 0.0024 when properly bonded between flat surfaces)

92ML materials are thermally enhanced laminates and prepregs specifically engineered and manufactured to meet the demands of high power applications. These materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. 92ML materials are ideal for multilayer applications requiring thermal management throughout the entire board. The high thermal conductivity of up to 3.5 WmK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc.

Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer. It is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric. 3001 bonding film is available in a thickness of 0.0015" (0.038mm), in continuous 12" (305mm) wide rolls, on standard 3" ID (inside diameter) cores.

2929 Bondply is an unreinforced, thermoset based thin film (available in 1.5, 2, and 3 mil) adhesive system intended for use in high performance, high reliability multi-layer constructions. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer blind via fill capability.