Rogers Corporation

ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and dielectric material and was developed specifically for multi-layer substrate constructions. ULTRALAM 3908 bondply is characterized by low and stable dielectric constant, which is required for high frequency, high-speed products. This product can be used for multilayer constructions with other Rogers ULTRALAM 3000 family of LCP circuit materials such as ULTRALAM 3850 double clad laminate. ULTRALAM 3908 bondply materials conform to the requirements of IPC 4203TBD. The UL file number is E122972.

Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer. It is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric. 3001 bonding film is available in a thickness of 0.0015" (0.038mm), in continuous 12" (305mm) wide rolls, on standard 3" ID (inside diameter) cores.

RO4000® dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ , and RO4000 LoPro™ glass reinforced hydrocarbonceramic laminates have been used in layers where RF microwave frequency, dielectric constant, or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers. The RO4400™ prepreg family is comprised of four grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B or RO4000 LoPro laminates.

2929 Bondply is an unreinforced, thermoset based thin film (available in 1.5, 2, and 3 mil) adhesive system intended for use in high performance, high reliability multi-layer constructions. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer blind via fill capability.

COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatible Low flow during pressure cure Bonds RF PCBs to heat sinks, pallets and housings Features Thermally and Electrically Conductive Bond Interface Supplied on PET Carrier on PET carrier Low Flow During Pressure Cure High Bond Strength & Thermally Robust Lead-free Solder Compatible and Chemically Resistant

CuClad® 6250 Bonding Film is an ethylene-acrylic acid thermoplastic copolymer. It is recommended for bonding dielectric structures including PTFEGlass (Polytetrafluoroethylene) substrates where exposure to high temperature or high pressure are not desirable. CuClad® 6250 Bonding Film is available in thickness of 0.0015" (0.038 mm).It is supplied in 24” (305mm) roll form and sheeted format. Important Note: Thermoplastic film with a melt temperature of 213°F (101°C). Features Dielectric Constant 2.32; Loss Tangent 0.0015 Resin Melts at 213°F (101°C) Low Pressure Lamination