Our Products

Since our inception in 2002, Saline Lectronics specializes in manufacturing innovative, mid-volume, high-mix electronic printed circuit board assemblies within our 110, 000 sf2 static controlled facility. We understand that it takes an enormous amount of trust to contract out the manufacturing of your product, and we value the opportunity to be your PCB Assembly provider.

Each client that we partner with gets matched with an assigned Project Manager and Product Realization Team that will closely monitor your PCB Assembly order throughout our facility. Your assigned Project Manager will function as your internal liaison working as an inside voice to help guarantee that your requirements are being communicated correctly and within a timely fashion.

Equipped with the latest manufacturing equipment available on the market, we assemble the most challenging PCB assemblies. Within a lean system, each product that we build is set-up for manufacturing in the most ideal process flow for that unique end-product. Whether that means x-ray inspection for tight BGA placements, or selective soldering of components on a customized pallet, your product will receive the specific manufacturing plan that it deserves.

Whether your PCB assembly is a simple, 4-layer board with only SMT components and Class 2 requirements; or a Class 3, complex 20-layer board with mixed-placement technology and specific thermal requirements, were the electronic contract manufacturer to assemble it for you.

As electronic products continue to evolve with advanced requirements to fit within irregular three-dimensional housings or to withstand intense vibrations, many of our clients are turning to flex and rigid-flex solutions for their circuit board assemblies. Due to this increased demand, we now assemble highly-complex flex PCB Assemblies and rigid-flex circuit board assemblies on a regular basis.

Intelligent Oven Systems
On each of our SMT Lines, we have 9-zone Heller ovens. Integrated with KICs smart oven technology and RPI System, we monitor and track by serial number the oven profile for every single PCB assembly. During the reflow process, the KIC System will automatically alarm should anything change with the profile, giving us ample time to rectify the issue in order to guarantee that every PCB assembly will be processed in spec.

Utilizing an encapsulated electronics-grade potting material for a PCB assembly will provide more robust protection than conformal coating giving your electronics assembly extreme protection against the harshest of environments. Our potting ensures a high level of protection against tampering and reverse-engineering. Since potted assemblies cannot be serviced or repaired, we always recommend that your potted PCB assembly includes testing both pre- and post-potting.

Potting molds can be customer supplied, or designed in-house by one of Saline Lectronics Engineers based on provided customer specifications. Most of the potting we perform is done with a standard material Epic Resins S-7302 medium durometer urethane we also have additional experience utilizing epoxy, urethane and other gel-type encapsulants.

Conformal coating provides your printed circuit board assemblies with harsh environment protection including fortification against dust, moisture, chemicals and extreme temperatures. Depending on the type of material, thickness and coverage required, conformal coating at Saline Lectronics will be applied either by machine or hand. We offer the following conformal coating materials, and can accommodate most customer coating requests:

HumiSeal UV40
HumiSeal 1B73
HumiSeal 1A33
HumiSeal 1B31

Due to size constraints or cost limitations, certain electronic products specify wire bonding requirements as this process is one of the most flexible interconnect technologies available. In response to this increasing demand, Saline Lectronics has a K&S Manual Wedge Bonder to perform wire bonding assembly in-house. This new tool will allow us to support complex wedge bonding requirements.

Our wire bonding capabilities are perfectly suited for chip-on-board assembly, hybridmulti-chip modules, microwave products, and optoelectronic parts. We are able to support both aluminum and gold wire, with a 3 mm wire maximum limitation. Additionally, we can utilize ribbon with a maximum size of 1 mm by 10 mm.

Long-term we plan to add even more services to our micro-assembly work area including die attachment, encapsulation and micro-assembly dicing.

High-Speed SMT Machines
Utilizing Juki's SMT pick-and-place equipment on all 6 of our SMT Lines, these high-speed machines are integrated directly with Cogiscans TTC System. Tracking every component placed on the PCB to the reference designator, we can offer advanced traceability. Additionally, with the Intelligent Feeder System, the Juki platform will not operate unless all reels are loaded in the correct order. Automatically sharing data with the Juki Fortresses, were able to effectively reduce production time and better ensure quality.

Solder Paste Inspection & Verification
Due to the majority of SMT defects originating in the printing process, our stencils are verified through an SPI machine to verify solder coating, thickness, aperture as well as printing press and speed. Linked directly to our AOIs, our Mirtec SPI machines automatically share real-time data allowing our team to quickly analyze root-cause on any failures.

Inventory Management Towers
Equipped with three ISM-2000 Juki Fortresses, these intelligent inventory management systems store components within an ESD and humidity controlled environment. Linked directly to Cogiscans TTC System, the Fortresses communicate directly with our Juki SMT Lines. When a SMT machine starts to run low on a component, a low-level warning alarm will alert and trigger the Fortress to automatically dispense the replacement reel. This automatic system and M2M communication saves a significant amount of labor and production time.

Solder Paste Printers
Installed on each SMT Production Line, our DEK Printers offer unparalleled consistency and accuracy. With automatic paste dispense and squeegee pressure calibration, we are able to get the ideal solder paste profile for each unique PCB assembly.

Mirtec AOI's are at the end of each SMT Line performing 100% automated optical inspection on every SMT placement in order to verify solder quality, part markings, pad placement, and solder joints. Enabled with M2M communication to our Mirtec SPI machines, we can automatically troubleshoot any AOI failures and immediately investigate the printing verification data.