Sierra Circuits

AVOID PCB ASSEMBLY DELAYS No more miscommunication between multiple vendors. No more delays. Sierra Circuits is exactly what you've been looking for.

Sierra Circuits is a US based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using 50 micron laser drilled via-in-pad technology and thin build-up materials. Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help. Experience our expertise and feel the difference.

Sierra Circuits is more than just a leading PCB manufacturer. We are a one-stop shop for all your PCB assembly needs. We provide in-house fabrication, assembly and turnkey services within five days or less.

Our No Touch self-service ordering system enables you to specify two-layer, four-layer, and six-layer prototype PCBs entirely online for quickturn delivery at the minimum cost. Using No Touch, you can automatically verify your design, get a quote, and submit your order in one smooth transaction. Highlights 2, 4, 6 layer low-cost, quickturn prototype PCB fabrication Pre-defined specifications Automatic file verification Free instant DFM on your files Find whether your design matches No Touch specs See layer images as seen by our system to ensure proper registration, polarity etc Get a Netlist compare report No holds processing Minimum finished hole size down to 8 mils Trace space down to 4 mils Now allows 0.250" (250 mils) Non-Plated Holes RoHS-Compliant (Lead-free material and surface finish) Instant online quoting, ordering and tracking

In 2005 Sierra opened a new Microelectronics Division to serve the fast growing need for really small, complex PCBs for the Microelectronics market. This division provides PCBs with less than 2 Mil (0.002") lines and spaces. 30 Micron LinesSpaces (1.25 mils) (0.00125") Very Thin Film Build-Ups down to 1 mil thick Low CTE Metal Cores Coplanar Surfaces Blind Buried Vias Multilayer Sequential Buildup Laser-drilled holes as small as 2 mils Fast Delivery ( Can engage in R&D projects Microelectronics Features and Applications 200 micron core via pitch 50 micron laser drilled vias 25 micron traces and spaces Semiconductor Packaging Substrates Wire bond and flip chip Chip Scale Packages (CSP)