Dimensions : 36"L x 18"W x 44"H (915mm x 457mm x 1118mm)
Weight : 224 lbs / 101 Kg
Power : 208-240 VAC 25A,1 Phase, 50/60 Hz
Air / Gas : 95-120 PSI @ 4 CFM
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes. Precise mechanics and advanced software simplifies the optical alignment, placement, and bonding stages of the process. Operator involvement is limited making thmore...
