Barry Industries manufacturers chip terminations on Alumina, AlN or BeO in Half Wrap to Ground and Surface Mount configurations. These chip terminations are available in sizes 0202 to 3737 and offer favorable return loss over a broad spectrum. Maximum power disipation is 250W.TV Style
Top only input pad one side, wrap to full metal backpad (GND) on the other side, TVC Style
Top only input pad on one side, castellated connection to full metal backpad (GND) on the other side