Barry Inc.

United States

Barry Industries manufacturers chip terminations on Alumina, AlN or BeO in Half Wrap to Ground and Surface Mount configurations. These chip terminations are available in sizes 0202 to 3737 and offer favorable return loss over a broad spectrum. Maximum power disipation is 250W.TV StyleTop only input pad one side, wrap to full metal backpad (GND) on the other side, TVC StyleTop only input pad on one side, castellated connection to full metal backpad (GND) on the other side

Barry Industries manufacturers Wraparound chip attenuators on Alumina, AlN or BeO for solder or epoxy surface mount attachment. These chip attenuators are available in sizes 0405 to 1612 with standard attenuation values from 0dB to 32dB. Other values available.

Barry Industries manufacturers Half Wraparound chip attenuators on Alumina, AlN or BeO for solder or epoxy surface mount attachment. These chip attenuators are available in 11 size from 0405 to 3737 with standard attenuation values from 0dB to 32dB. Other values available.

Barry Industries manufacturers a compact 0405 size 14 Wraparound chip attenuator on Alumina for solder surface mount attachment. Standard attenuation values are from 0dB to 32dB. Other values available.

Barry Industries manufacturers 3-Sided Wraparound chip attenuators on Alumina, AlN or BeO for solder or epoxy surface mount attachment. These chip attenuators are available in sizes 0405 to 2525 with standard attenuation values from 0dB to 32dB. Other values available.

Barry Industries manufacturers Flip Chip attenuators on Alumina, AlN or BeO for solder or epoxy surface mount or wirebond attachment. These chip attenuators are available in sizes 0706 to 2525 with standard attenuation values from 0dB to 32dB. Other values available.

Barry Industries manufacturers Balanced Wraparound chip attenuators on Alumina, AlN or BeO for solder or epoxy surface mount attachment. These chip attenuators are available in sizes 2010 or 2335 with standard attenuation values from 0dB to 32dB. Other values available. Maximum power disipation is 150W.

Barry Industries manufacturers 'Flip Chip' w Backplane resistors on Alumina, AlN or BeO for solder, epoxy or wirebond attachment. These chip resistors are available in sizes 0402 to 5050 with standard resistance of 0.1 to 1G and resistor tolerance to 1%. Other values are available.The RM Series resistors feature a full backplane for maximum contact with your heatsink.

Barry Industries manufacturers Flip Chip with Backplane chip attenuators on Alumina or BeO for solder or epoxy surface mount or wirebond attachment. These chip attenuators are available in sizes 0706 to 1612 with standard attenuation values from 0dB to 32dB. Other values available.