United States
Our Products
Sealed all-metal construction. Electronically passive, no active electronics. 5, 10, 20 IO slot BMI sizing. Pinless IO slots using inductive interconnection. Symmetric IO slots with inductive coupling. Redundant Power, Control, IO Module support. Operating temperature -40 C to +80 C. No fans. Highest calculated MTBF possible for an ICS. Holistic thermal coupling. Heat sink and passive cooling for all system modules. Best system ambient temperature performance. +50-year life. Higher durability. Extreme EMP and EFT hardened. IEC600068 durability hardened. FIPS 140-2 anti-tamper compliant. Intrinsic cyber hardening.
Bedrock Automation