Sealed all-metal construction. Electronically passive, no active electronics. 5, 10, 20 IO slot BMI sizing.Pinless IO slots using inductive interconnection. Symmetric IO slots with inductive coupling. Redundant Power, Control, IO Module support. Operating temperature -40 C to +80 C. No fans. Highest calculated MTBF possible for an ICS. Holisticthermal coupling. Heat sink and passive cooling for allsystem modules. Best system ambient temperatureperformance. +50-year life. Higher durability. ExtremeEMP and EFT hardened. IEC600068 durabilityhardened. FIPS 140-2 anti-tamper compliant. Intrinsiccyber hardening.