Ceramic Technologies, thru Denka Corporation, offers Aluminum Nitride substrates. Denka actually makes its own Aluminum Nitride powder, so there is total production control from the raw material through copper bonding. The AIN plate offers a thermal expansion coefficient that is close to silicon. These subtracts offer a thermal conductivity, almost 7 times higher than alumina. The material is a superb heat-sink. Our subtracts offer the highest quality and cost-performance seen in the market.