Soldering Accessories

Kester SELECT-10 is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. Specific to selective soldering, SELECT-10 does not spread beyond the spray pattern and will not clog the fluxer head. SELECT-10 residues are non-tacky for improved cosmetics. SELECT-10 is classified as ROL0 flux under IPC J-STD-004B.

Kester NF372-TB is a zero-halogen, no-clean, low solids liquid flux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. NF372-TB residues are minimal, clear and non-tacky for improved cosmetics. NF372-TB is classified as ROL0 flux under IPC J-STD-004B.

Kester 985M is a low solids, halide-free, no-clean flux that is designed for wave solder, selective solder and touch up processes. 985M was developed for use with both traditional tin-lead and lead-free solder alloys. 985M exhibits improved soldering performance to minimize solder bridges (shorts) during all soldering operations. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. As tested under J-STD-004A specifications 985M is classified Type ROL0.

Kester 952-S is a zero-halogen, non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) module industry by soldering tabs to cell contacts. 952-S could be applied directly to interconnecting ribbon by hand soldering or auto-equipment with tabber and stringer soldering system, by dipping or spraying. The extremely low solids content (around 2%) and nature of the activator system results in practically no residue left on the cell after soldering. Cell are dry and cosmetically clean as they exit the tabber and stringer machine. 952-S has a wider operating window varying with temperature range, and can be used in SnPb, SnAgPb and Pb-free alloys.

Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. 959T was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. 959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. 959T leaves evenly distributed residues for the best cosmetic appearance.

Kester 979VT is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of lead-free electronic circuit board assemblies. This fluxs finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. 979VT also reduces micro-solderballing on glossy and matte laminates and between connector pins. 979VT will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. It has been specially formulated to accommodate needs of single sided board assemblers. 979VT leaves no haze or visible residue behind, including the white powdery residue associated with use of earlier no-clean formulas. The miniscule amount of non-visible residue that remains after soldering is non-conductive, non-corrosive, and does not need to be removed.

Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the computer, telecommunications and other industries. No offensive odors will be emitted during soldering. 2331-ZX will not create excessive foaming in standard water cleaning systems. 2331-ZX has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.

Kester 2235 is a high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. 2235, a flux with comparably low solids in respect to other fluxes in the same category, will produce fewer skips on the bottom side surface mount pads. The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. No offensive odors or excessive smoke are emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.

Kester 186, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.