Diamonds

We offer a complete product range of Metal Bond Micron Diamond, Resin Bond Micron Diamond, Metal Bond Mesh Diamond, Metal Bond Saw Grit Diamond and Resin Bond Mesh Diamond

Metal Bond Mesh Diamond

ABC Superabrasives Mesh Brand SG 30 = GDW-1 (60 / 70 to 230 / 270) SG 40 = GDW-2 (60 / 70 to 230 / 270) SG 40 = GDW-2 (270 / 325 & 325 / 400) SG 50 = GDW-3 (60 / 70 to 200 / 230)

Metal Bond Mesh Diamond Saint-Gobain Surface Conditioning's metal bond mesh diamond is a synthetic material, grown slowly compared to resin bond diamond, resulting in monocrystalline structures with high toughness. The typical blocky crystals are suitable for resin, metal and electroplated bond systems in applications such as grinding ceramics, cemented carbides and glasses. Our bond mesh diamond is typically 40m and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight. Saint-Gobains electroless coated particles extend grinding wheel performance through improved heat removal from the grinding zone and increased abrasive adhesion in the bond system.

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Metal Bond Saw Grit Diamond

ABC Superabrasives Mesh Brand SG 20 = ABS-1 (30 / 40) SG 20 = ABS-1 (40 / 50) SG 20 = ABS-1 (50 / 60)

Metal Bond Saw Grit Diamond Saint-Gobain metal bond saw grit diamond offers extremely high strength, low metallic inclusions, excellent thermal stability and controlled shape. This diamond type is intended for use in tough cutting environments, making it ideal for stone, construction and mining applications. Our metal bond saw grit diamond is typically 40m and larger in particle size.

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Resin Bond Mesh Diamond

ABC Superabrasives Mesh Brand RB (60 / 70 & 70 / 80 & 60 / 80 & 80 / 100) RB (100 / 120 to 325 / 400) R-Ni30% (60 / 70 & 70 / 80 & 80 / 100)

Resin Bond Mesh Diamond Saint-Gobain Surface Conditioning's resin bond mesh diamond is a synthetic material with a friable crystal structure for use in vitrified and resin bond systems. The crystals are irregular, elongated and rough-edged, and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. Grains are microfractured during grinding and new edges formed for efficient, free-cutting action. Resin bond mesh diamond is typically 40m and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight.

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Metal Bond Micron Diamond

Warren Micron Brand MB (< 0.25μm) MB (0 - 0.25μm to 50 - 60μm)

Metal Bond Micron Diamond Warren Superabrasives Saint-Gobain Surface Conditioning A synthetic material, grown slowly compared to resin bond diamond, Saint-Gobain Surface Conditioning's metal bond micron diamond features monocrystalline structures with high toughness. The typical blocky crystals are suitable for resin, metal and electroplated bond systems in applications such as grinding ceramics, cemented carbides and glasses. They are also extensively used in polishing and other surface conditioning applications. Processed using state-of-the-art grading equipment, Saint-Gobain metal bond micron diamond provides well-controlled particle size distribution and surface cleanliness in a wide range of challenging applications.

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Resin Bond Micron Diamond

Warren Micron Brand RB Micron 0 - .20 0 - .50 0 - 1 0 - 2 1 - 2 1 - 3 1.5 - 3
ABC Micron Brand RB Micron 0 - .20 0 - .50 0 - 1 0 - 2 1 - 2

Resin Bond Micron Diamond Warren Superabrasives Saint-Gobain Surface Conditioning Designed for use in vitrified metal and resin bond systems, Saint-Gobain Surface Conditioning's resin bond micron diamond is a synthetic material featuring a friable crystal structure. Widely used for lapping and surface conditioning on a diverse range of materials, resin bond micron diamond features irregular, elongated, rough-edged crystals that are ideal for grinding tungsten carbide, ceramics and glasses. The friability or breakdown of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed, providing efficient, free-cutting action. Our resin bond micron diamond is processed using state-of-the-art grading equipment to ensure tightly controlled particle size distribution and surface cleanliness for a variety of demanding applications.

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