SOURIAU PA&E

United States

Over the past decade, PA&E has provided customers with the hermetic connector and packaging technologies available. With the introduction of its thermal composite packaging, this trend continues. The technology uses titanium as the primary housing material and integrates composite heat-sinks composed of molybdenumcopper (MoCu) or copper tungsten (CuW) into strategic locations of the structure for excellent heat dissipation capabilities. The combination of titanium and MoCu or CuW is ideal for achieving lightweight, low-coefficient of thermal expansion (CTE), and high-thermal-conductivity electronic packages. Electrical feedthru pins can be hermetically sealed directly into the titanium using PA&Es proprietary Kryoflex ceramic to metal seals. Alternately, hermetic connectors made from explosively bonded dissimilar metals can be laser welded into position using state of the art Lasag laser welding technology.

Titanium is the material of choice for housings because of its commercial availability along with its characteristics that allow for conventional machining and low-density attributes. Titaniums CTE is compatible with direct attachment of aluminum oxide and gallium-arsenide electronic circuitry. Titanium is 300% stiffer than aluminum and can hermetic with walls as thin as .010. This means an existing aluminum package can be redesigned to be stiffer, lighter weight, more reliable, and better thermally by integrating PA&Es titanium composite technology. Titanium is compatible with both resistance and laser welding processes for flexibility in connector integration and cover sealing. Titanium is also conducive to metal injection molding, making it a viable option for high-volume manufacturing.