- Application\Semiconductor Laser Diodess
- Semiconductor Base MaterialGaAs
By leveraging our core technologies of materials science for refractory metals, Spectra-Mat, Inc. has a full range of products for the thermal management of sophisticated devices, mainly based on GaN and GaAs, where heat generation is localized in small areas: by infiltrating high purity copper into W or Mo, Spectra-Mat, Inc. is able to provide tailored materials in terms of thermal expansion and thermal conductivities to even the most demanding applications. In particular, molybdenum copper (MoCu) is 40% lighter than tungsten copper (WCu), which makes it a superior alternative for weight sensitive applications. Our materials are manufactured starting from very high purity W and Mo powders with no additives, assuring their homogenous metallographic structure and hermeticity. Spectra-Mat, Inc. can provide tungsten copper and molybdenum copper parts in different shapes and sizes to address different applications needs: we offer small submounts for semiconductor lasers, large bases for GaAs GaN power amplifiers and fiber lasers, flanges and carriers for single chip RF and MW GaAs and GaN diodes. Spectra-Mat, Inc. has already recognized the importance of wafer level packaging, especially for cost sensitive applications such as high brightness LEDs: 2’, 3”, 4” and 6” WCu and MoCu wafers are available to meet next generation packaging requirements. Spectra-Mat, Inc. is also working in the addition of a ceramic layer on top of WCu and MoCu material to extend the use of our thermal management materials to other substrates types such as silicon carbide (SiC), sapphire (Al2O3) and silicon (Si). The main applications of Spectra-Mat, Inc. thermal management materials are: High power semiconductor lasers RF and MW GaAs & GaN diodes and transistors High brightness LEDs Power Electronics (IGBTs, MOSFTEs) MEMS and MOEMS Fiber lasers MMICs GaAs concentrated photovoltaic cells Microprocessors for high end servers Infrared sensorsApplication