Electric Circuit Components & Parts

Custom Manufacturing of Double Sided PTFE PCB for the Telecom Industry

With a combination of specialized processes and equipment, the boards were custom manufactured from double-sided glass-reinforced PTFE. This PCB is used for controlled impedance within a microwave application.

Utilizing advanced photolithography and chemical etching, trace widths are controlled to a +- .001" . CNC machines are used to bring the part to its final shape and size.

This board was manufactured and inspected to the specifications of IPC-6018 Microwave End Product Board Inspection and Test standards. Their expectations for both design and quality were fulfilled. All finished units were delivered to our customer's facility in the Northeastern US.

Custom Manufacturing of Multilayer FR4 PCB for the Industrial Controls Industry

This 12 layer, FR4 printed circuit board (PCB), shown to the right, was custom manufactured by Standard Printed Circuit Boards for the industrial controls industry. The first step was to pull the proper laminates for innerlayer manufacture. Tooling holes were drilled in the panels and the order moved to the Imaging Department. Our skilled technicians utilized various Photolithographic methods to transfer the customer's design to the innerlayer panels and performed a thorough in-process inspection. Next the innerlayers moved into the Etching Department where all unwanted copper was chemically removed. Again, a thorough in-process inspection ensured that all specifications were met.

After receiving an oxide treatment, the innerlayers travelled into Lamination where layup of the panels took place. The hydraulic press was setup to laminate the panels at the proper pressure, temperature, and duration in order to create a high quality bond between all the layers. A cool down cycle took place before the panels moved into primary drilling.

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Multilayer FR4
After primary drill, the panels were placed in our plasma etching unit where any residual drill smear was removed from the interior of the hole wall. This step helped to ensure the electrical integrity between the innerlayers and the plated holes. The panels then moved into our Direct Metalization Line where a conductive polymer was chemically bonded to the interior hole wall to facilitate subsequent copper electro-plating. After outer layer imaging, the panels were processed through the full build electrolytic copper line where a 1 mil minimum copper thickness was deposited on the hole walls and surface areas. A tin or tin-lead etch resist followed the copper process as the panels moved into the final etching process.

The boards were then coated with a liquid photoimageable (LPI) soldermask, baked thoroughly, and then moved into ENIG where a layer of gold was deposited over nickel on all the exposed copper surfaces and holes. The boards were then returned to the soldermask area to receive a silkscreened legend which will later assist in component placement during assembly. The boards then travelled in to Final Routing where CNC routers machined the boards to their final size and shape. The completed boards then proceeded to Final QA for inspection and Electrical Testing. 24 multilayer FR4 printed circuit boards were built for this client, vacuum packaging and delivery of all units to their facility in New York. The product met or exceeded both IPC-6012B and IPC-A-600 industry standards.

Custom Manufacturing of Multilayer Mixed Dielectric PCB for the AerospaceDefense Industry

Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Beginning with Inventory, all the correct materials were pulled and checked against customer requirements and specifications.

Initially, all innerlayers were drilled, imaged, and etched. The innerlayers then proceeded to Lamination where they were pressed into panels using low Dk bonding films. After lamination and cool-down, the panels moved to drilling where all primary holes were drilled. To prepare the hole walls for Direct Metallization, the panels were processed through Plasma and Sodium etching.

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Multilayer Mixed Dielectric
After DMS, the outerlayers of the panels were imaged, copper plated, solder plated, and etched. Trace widths had to be controlled to +- .0005" to provide the end product with proper electrical characteristics. A Liquid Photoimageable (LPI) soldermask was applied, followed by a ENIG (Electroless Nickel Immersion Gold) final finish. Using a number of product evaluation techniques, including flying probe testing, we ensured that this PCB met with all client product requirements. The boards were vacuum packaged and shipped to their facility in Northeastern US.

Custom Manufacturing of Double Sided FR4 SMT PCB for the Instrumentation Industry

A client from the Instrumentation Industry contracted to custom build this double sided printed circuit board (PCB) used within an electronic instrumentation application. This PCB design utilizes surface mount technology. Meeting client specifications, our company manufactured 250 boards for this client.

To begin this project, we pulled all the necessary laminates from stock and drilled all necessary holes. Direct metallization was performed to produce conductive hole walls. We also deburred the PCBs, providing a smooth surface, and carried out primary imaging.

After imaging, the PCBs were plated in copper, then solder, and finally etched to remove excess copper from panels. We also applied all LPI solderamask and silkscreen graphics to the PCB. Holding tolerances as tight as .005", we manufactured these PCBs to measure 10.5" x 8". Meeting high industry standards for both quality and performance, all finished units were vacuum packed and shipped to our client's facility in New York.

Custom Manufacturing of Double Sided Polyimide High Temperature PCB for the TelecomIT Industry

Standard Printed Circuit Boards custom manufactured over 1, 000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the TelecomIT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250 Celsius.

Some of the processes used to manufacture these boards included:

Shearing all raw material to size
Drilling all necessary holes
Copper plating
Chemical etching to remove excess copper material
Primary imaging
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Double sided polyimide PCB
In addition to these processes, hot air solder leveling was also performed, adding an extra layer of protective metal over the copper surface. Holding tolerances as close as .005", the finished PCBs were constructed from polyimide laminate and measured 10.5"x 3". Meeting stringent industry standards and client specifications, we delivered all finished units to our consumer's facility in Southwestern US. The units fulfilled our customer's high expectations for both quality and high temperature reliability.