Our Products #4982113

Molex's Laser Direct Structuring (LDS) Technology offers flexibility and geometric 3D design freedom in making antenna products beyond the previously often used flex-antenna technologies, which only allow a maximum 2.5 D design of the antenna radiator. Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a molded antenna carrier or even directly onto the device structure. Cosmetic surfaces of the antenna can also be achieved by using a subsequent spray painting process.

Based on diverse manufacturing and RF technologies, Molex standard antennas offer high performance and ease of integration for demanding wireless applications spanning the industrial, consumer, medical and automotive marketsThe development of M2M, IoT and consumer wearable technologies placed new requirements on antenna design and performance with space, cost and speed-of-integration as key components of advanced wireless manufacturing. Growing demand for dual-band, multi-band, ultra wide band, GPS and Cellular antennas with combo capabilities that reduce engineering support at component level design right through to how easily these antennas connect to the radio devices they operate with, determine the justification of their deployment in these applications. Molexs expanding array of antenna solutions address present connectivity requirements with anticipated support for revolutionary communications of the future.

Molex has developed an innovative Molded Interconnect DeviceLaser Direct Structuring (MIDLDS) capability under MediSpec that will allow medical device designers to integrate highly complex electrical and mechanical features into highly compact applications which existing flat 2D technologies cannot accomplish.This capability combines the versatility of the two-shot molding process for MID, with the speed and precision of Laser Direct Structuring (LDS) technology to create compact, high-density medical applications that meet required medical-grade, electronic device guidelines. LDS allows micro-line electronic circuitry to be imaged onto a variety of RoHS-compliant molded plastics using a 3-axis laser with the added flexibility of making pattern changes. Lines and spaces down to 0.10 mm and circuitry pitch down to 0.35mm are possible in high-volume. A host of other multi-function features including laser-drill via holes, switch pads, sensors, or even antennas, can be added if needed.

Ideal for hand-held to large devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and optimized packagingRigid flex circuits and assemblies are hybrid constructions consisting of rigid and flexible substrates laminated together into a single structure. Rigid Flex products integrate the features of a PCB with the advantages of flexible printed circuit (FPC) technology. Rigid flex circuits should not be confused with rigidized flex constructions that are simply flex circuits with locally attached stiffener(s) to support electronic components. Rigid Flex circuitry can be built with three or more layers of conductors. Molexs Rigid Flex increases reliability and reduces costs by eliminating connectors and cables, allowing tighter packaging and reducing application weight. Rigid Flex Assemblies allow the end user to process multiple board and cable terminations in one pass of the reflow process. It is a complete, applied-cost solution that should be considered early in a customer design.

Molex's Copper Flex Interconnect Assemblies provide flexible mounting assembly options when there is space and weight concerns and printed circuit boards are not an optionVirtually unlimited variety of component placement options available including SMT, BGA, Through-hole and pressfit. We provide the total assembly solution from build-to-print to new, custom design utilizing Molex connector products. With global manufacturing capabilities, we can provide the most cost effective flex interconnect solutions to meet a large variety of applications.

Point-to-point Copper Flex Jumpers from Molex improve power and signal routing while reducing package size and weight for electronic interconnect devicesFlex jumpers are used as high-density point-to-point jumpers where space, routing or weight are concerns. Jumpers are also used in dynamic flexing applications such as hinges and hand-held devices. Generally used with ZIF-style or board-to-board connectors. Molexs Copper Flex Jumpers are a low cost way of interconnecting boards.

High-Density Copper Flex Cable products that offer micro via and fine line features required for todays circuit designs in support of small, tightly compacted, electronic packaging solutionsWhen routing space and via diameters need to be minimized, Molex HDI Copper-Flex Products offer a cost-effective substrate solution. In fact, high-density flex enables line width, spacing and pad size to be up to 50% smaller and hole size up to 75% smaller than standard flex. Additionally, high-density flex capabilities provide a three-dimensional packaging option. When package size and component density are limiting available board space and layer count, turn to Molex High-Density Copper Flex to solve packaging challenges.

High-Speed Copper Flex Assemblies are multi-layer flex assemblies that cover the full range of high-speed interconnectsMolex High-Speed Flex Assemblies are customized products with a flat, thin construction and high circuit density. They are compatible with a variety of Molex high-speed connector systems, enabling signal transmission up to 56 Gbps while providing mechanical advantages in space-constrained designs.

Capacitive sensors ensure precise fluid-level measurements with greater accuracy and lower set-up costs, utilizing customized end-to-end solutions and easy-to-install calibration softwareCapacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy.Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy. Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy.Capacitive Fluid Level Sensors easily mount to the outside of a container and measure through almost any non-metallic material. They are custom designed and optimized for a range of applications such as medical devices, pump controls, beverage machines etc. A design can use a traditional printed circuit board for a flat surface, or a thin, flexible circuit to accommodate curved surfaces or space-constrained applications. The sensor includes customized embedded software which can be configured for auto-calibration for easy installation, or manual calibration to maximize the accuracy.

Molex delivers high-performing Silver Flexible Circuit Solutions with finely spaced, narrow silver traces and complex components on polyester substrate, offering an economical alternative to traditionally etched copper traces on polyimide Polyester (PET) substrate Provides a flexible substrate alternative to rigid printed circuit board (PCB)More cost-effective than polyimide Proprietary soldering technique Supports attachment of fine-pitch (0.50mm) microprocessor-based components (ICs) on PET with traditional SMT processes UV-cured encapsulant Protects solder joints, enabling them to withstand vibration and mechanical shockOffers robust connection that tolerates a wide variety of applications Does not require harsh chemicals or a waste treatment facility Offers an environmentally friendly component

Ideal for hand-held to large devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and optimized packagingRigid flex circuits and assemblies are hybrid constructions consisting of rigid and flexible substrates laminated together into a single structure. Rigid Flex products integrate the features of a PCB with the advantages of flexible printed circuit (FPC) technology. Rigid flex circuits should not be confused with rigidized flex constructions that are simply flex circuits with locally attached stiffener(s) to support electronic components. Rigid Flex circuitry can be built with three or more layers of conductors. Molexs Rigid Flex increases reliability and reduces costs by eliminating connectors and cables, allowing tighter packaging and reducing application weight. Rigid Flex Assemblies allow the end user to process multiple board and cable terminations in one pass of the reflow process. It is a complete, applied-cost solution that should be considered early in a customer design.