Temp-Flex Cable, Inc.

Based on diverse manufacturing and RF technologies, Molex standard antennas offer high performance and ease of integration for demanding wireless applications spanning the industrial, consumer, medical and automotive markets The development of M2M, IoT and consumer wearable technologies placed new requirements on antenna design and performance with space, cost and speed-of-integration as key components of advanced wireless manufacturing. Growing demand for dual-band, multi-band, ultra wide band, GPS and Cellular antennas with combo capabilities that reduce engineering support at component level design right through to how easily these antennas connect to the radio devices they operate with, determine the justification of their deployment in these applications. Molex’s expanding array of antenna solutions address present connectivity requirements with anticipated support for revolutionary communications of the future.

Point-to-point Copper Flex Jumpers from Molex improve power and signal routing while reducing package size and weight for electronic interconnect devices Flex jumpers are used as high-density point-to-point jumpers where space, routing or weight are concerns. Jumpers are also used in dynamic flexing applications such as hinges and hand-held devices. Generally used with ZIF-style or board-to-board connectors. Molex’s Copper Flex Jumpers are a low cost way of interconnecting boards.

Molex's Laser Direct Structuring (LDS) Technology offers flexibility and geometric 3D design freedom in making antenna products beyond the previously often used flex-antenna technologies, which only allow a maximum 2.5 D design of the antenna radiator. Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a molded antenna carrier or even directly onto the device structure. Cosmetic surfaces of the antenna can also be achieved by using a subsequent spray painting process.

Molex's Copper Flex Interconnect Assemblies provide flexible mounting assembly options when there is space and weight concerns and printed circuit boards are not an option Virtually unlimited variety of component placement options available including SMT, BGA, Through-hole and pressfit. We provide the total assembly solution from build-to-print to new, custom design utilizing Molex connector products. With global manufacturing capabilities, we can provide the most cost effective flex interconnect solutions to meet a large variety of applications.

High-Speed Copper Flex Assemblies are multi-layer flex assemblies that cover the full range of high-speed interconnects Molex High-Speed Flex Assemblies are customized products with a flat, thin construction and high circuit density. They are compatible with a variety of Molex high-speed connector systems, enabling signal transmission up to 56 Gbps while providing mechanical advantages in space-constrained designs.

Molex delivers high-performing Silver Flexible Circuit Solutions with finely spaced, narrow silver traces and complex components on polyester substrate, offering an economical alternative to traditionally etched copper traces on polyimide Polyester (PET) substrate Provides a flexible substrate alternative to rigid printed circuit board (PCB) More cost-effective than polyimide Proprietary soldering technique Supports attachment of fine-pitch (0.50mm) microprocessor-based components (ICs) on PET with traditional SMT processes UV-cured encapsulant Protects solder joints, enabling them to withstand vibration and mechanical shock Offers robust connection that tolerates a wide variety of applications Does not require harsh chemicals or a waste treatment facility Offers an environmentally friendly component