We offer a complete product range of WAFER BACKGRINDING PROTECTIVE-FILM REMOVER, FRAME FILM MOUNTERS, DIE-MATRIX EXPANDERS, Standard UV and Antistatic UV
Ultron Systems' Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicingsawing applications, uniform adhesive plastic film lamination is paramount. Our mounters feature an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller ensures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses. Using our Mounters, operator variables are virtually eliminated.
Ultron Systems' Model UH110 and UH110-8 Semiautomatic Film Removers demount film from 3" to 8" wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment. Throughput is as high as 200 wafershour. The standard Model UH110 can accommodate up to 6" wafers, while the Model UH110-8 handles 8" wafers and smaller. Adjustments from one size wafer to another can be made in seconds by simply changing the workstage. Push-button operation assures ease of use with all operator variables eliminated.- Short removal cycle for higher throughput - Virtual 180° peeling angle for lower wafer stress and higher yields - Heated wafer stage: ensures film removal with minimal stress to wafer - Quick peeling-tape reloading - Easy disposal of demounted protective film - No special operator training required - Compact, tabletop size - Faster and lower cost than conventional chemical removal method - Interchangeable wafer stage accommodates different sizetype of wafers - Removes film from wafers down to 8 mil thick wafer [UH110-8] - [Model UH110]: Up to 6" waferfilm frame capability (Standard wafer stage included) - [Model UH110-8]: Up to 8" waferfilm frame capability (Standard 8" stage included)
Ultron Systems' UV Adhesive Plastic Films have the advantage of high adhesive strength -- for the securing of waferssubstrates during sawing -- which becomes significantly reduced after UV light exposure, to facilitate die removal. This tape provides an ideal media for thin wafer dicing, followed by gentle die removal. We are proud to offer the widest selection of UV film available to meet even your most stringent process requirements. High adhesive strength (normally reduced after UV light exposure) - Consistent adhesive properties and uniform elongation properties - Exceptional quality - Wide range of UV film with different thicknesses and adhesive strengths
Ultron Systems' Antistatic UV Adhesive Plastic Films are the best choice when your process requirements are most demanding. For static-selective devices, do not let ESD become a process variable. The Antistatic layer dissipates negative charge build-up, typically resulting from removal of the protective backing film from the adhesivebase film, or during wafer mounting, sawing, etc. Additionally, the Antistatic UV Adhesive Plastic Film series share the same benefits as our standard UV films. Negative charge build-up is dissipated with our Antistatic layer - Same demanding film properties as our standard UV film - Selection of Antistatic UV film available for varying needs and requirements
Ultron Systems' Model UH132 Series Motor Drive Die Matrix Expanders set another higher standard in precision wafer expansion and die presentation. Based on the highly popular UH130 Series, the new UH132 sibling continues to offer precise control of die separation process parameters, but now incorporates a new motor drive design with digital speed control that offers even greater precision to wafer expansion by producing both linear and uniform expansion throughout the entire drive stroke. A new programmability feature of the UH132 Series allows pre-heat (dwell) time and ram speed to both be saved, providing total control and maximum accuracy and precision for consistent, repeatable results. Die separation distance is precisely controlled with the Model UH132 Series. - Accommodates up to 8" (200mm) wafersfilm frames (Model UH132) and 12" (300mm) wafersfilm frames (Model UH132-12) - Motor driven ram with digital speed control and 2.6" adjustable stroke (ram height) - Motorized circular cutter assembly (Standard on Model UH132-12; Option on Model UH132) - Digital temperature-controlled heated stage with thermistor - Adjustable stroke stop, resulting in consistent repeatability of expansion - Die separation distance precisely controlled for consistent repeatability - Exact height adjustment by 10-turn dial indicator (one-to-one ratio) - Up to 9 programs for adjustable pre-heat time (up to 99 seconds) & ram speed (18 speed settings) - Safety over-pressure sensor and slip clutch for ram stop - Emergency stop button - Plexiglass shroud, anti-static - Upper & lower clamp assembly - Lower clamp (outer grip ring) assembly & upper clamp (inner grip ring) assembly can hinge separately to allow use of larger grip rings (UH132-12) - Alignment pins provide easy and precise film frame placement - Reduced alignment times and increased yield from automated processes - Operator variables virtually eliminated