Other Products / Services

Hermetic Seal Corps standard range of GTMS bulkheads are designed to function in the severe operating conditions commonly encountered in oil & gas exploration and have been exposed to a combination of pressures and temperatures in excess of 25, 000 PSI at 400F (204C).

Building on this product experience HSC is extremely proficient in customizing the design of high pressure GTMS bulkheads to meet even higher pressures and temperatures, up to 35, 000 PSI at 500F (260C). We have the experience to design, manufacture and test your product.

Series 8000 The need for a hermetic class, MIL-DTL-5015 style connector existed long before this class was added to the Mil-Std. Because of this, Sealtron 8000 series does not meet all specifications shown in the current Mil Spec. See Sealtron 6000 Series if connectors of the latest revision of MIL-DTL-5015 are needed. The majority of the 8000 Series are manufactured with an individual seal around each contact; however the specified test voltage may be reduced. Connectors having an all glass insert are available upon specific request, if the higher test voltages are required. For corrosive or severe ambient conditions these connectors can be supplied with bodies of 300 series Stainless steel.

Series 6000 - These connectors meet the latest revisions of MIL-DTL-5015 and the applicable MS drawings. The shell can be supplied with 300 series Stainless steel or mild steel. Standard plating of the mild steel is fused Tin over Copper. Contacts are plated with a minimum of 50 micro inches of Gold. To improve moisture resistance, these parts are supplied with a cork and bottle designed interfacial seal bonded to the mating face.

The HTX is Hermetic Seals answer to the need for extreme harsh environment Hermetically Sealed Interconnects! Incorporating the latest Material Science, HSC has developed the next generation of Very High Temperature & High Vibration Interconnect system. Mated pairs available, dimensionally equivalent to MIL-DTL-83723 and EN2997

Hermetic Seal Corp manufactures a range of ruggedized multiple pin pressure bulkheads that combine a glass-to-metal-sealed core with an over molded thermoplastic jacket. The CPX range has been tested to 35, 000 PSI at 204C and is designed for use in the demanding conditions found in the downhole oil and gas industry.

We also make PEEK single feed thru's that are designed to withstand temperature and pressure combinations that reach 20, 000 PSI at 200C. HSC also supplies the mating socket and Viton boot kits.

Series 6400 These hermetic connectors are qualified to the latest international airframe specifications for ESC 10 YE and meet the dimensional requirements of ESC10YE1, ESC10YE2 and ESC10YE3. They qualified to operate at 260C cyclical temperature and compatible with an extended range of aerospace fluids.

Hermetic Seal Corporation specializes in the customizing of any of its products to meet your specific project needs with in-house machining, glass pre-form manufacturing and an extensive testing capability. Customization may take the form of, but is not limited to:

Alternate body diameters and lengths
Alternate pin diameters, lengths and termination types
Specialty materials and finishes (Including Aluminum)
Alternate insert arrangements
o We can design an insert arrangement with any combination of pin diameters to meet your needs for both power and signal throughput
Socket contacts
Rear release crimp socket contacts
Higher Dielectric Withstanding Voltage rating
Alternate O-ring materials and groove configurations suitable for custom mounting needs
Guide pins for blind mating applications
Threads on housings to allow attachment of back-shells or next level assemblies
Threaded inserts or threaded bushings in flange mounting holes
Alternate glass materials to withstand special circumstances, such as:
o Stable Insulation Resistance values at high temperatures
o Temperatures up to 800F (426C) at lower pressures
o Extreme levels of thermal cycling (-85F to +800F or -65C to +426C) at lower pressures
Precious metal plated surfaces on the housing to improve ground connection from the housing to next level assembly to reduce the impact of EMI conditions