EpoxySet, Inc.

United States

EB-406 is a fast setting, thermally conductive epoxy adhesive. It has a paste like consistency that makes it easily spreadable for a variety of applications. EB-406 is designed for the fastest and most continuous heat transfer than compared to many commercially available epoxies. Excellent for field use, EB-406 is a 1:1, non-critical, mix ratio available in dual cartridges. This product is an excellent for high efficiency in heat sink attachment to motherboards.

Many engineers, procurements specialists, and operators wonder what is a one component epoxy? A one component epoxy is simply an epoxy system with the curing agent premixed into the product. How come it doesnt cure right away? Most one component epoxy adhesives incorporate latent curing agents that only cure properly with an external catalyst such as heat. There literally hundreds of different types of curing agents and skilled formulators use these to create different products with different properties. Advantages of one component epoxies include high temperature operation, no mixing or weighing required, and continuous operational use. EB-403-1LV-T1 is a one component, thermally conductive epoxy adhesive. A highly thixotropic product, it does not run or sag at elevated temperatures and is designed to stay in place where applied. In the electronics industry, it is used to bond ferrite cores as well as drum core inductors. EB-403-1LV-T1 is a thermally conductive adhesive used in LED applications to dissipate heat away from high powered LEDs. EB-403-1LV-T1 can cure in minutes at 150C and withstand temperatures over 260C continuously.

EB-350M-7LV is a one component epoxy encapsulant intended for applications requiring excellent handling properties. This product has excellent handling properties and excellent compressive strength with a tested value of over 21, 000psi. Using specialty raw materials and extensive testing, this material is used for potting small electronic components used for applications to cure less than 50 grams. EB-350M-7LV is also an excellent alternative to a 2- part underfill with low linear expansion.

Thermal conductivity of adhesive systems depends on a number of factors including type and amount of filler, size of fillers, air etc. Many thermally conductive adhesive use one type of filler and one size of filler which adds conductivity but only a little. EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 WmK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding

With most products, both resin and hardeners are either the same color or the hardener is clear. It can be difficult to know when both parts are thoroughly mixed. Firstly, we recommend using proper mixers such as lab mixers, dynamic mixers, or high power industrial mixers. Using these types of mixers can ensure a uniform mix when done properly but how can you tell it is mixed well? Uniformity is the key to mixing 2 part epoxies. The final product should be a homogenous color, viscosity, and consistence. It should not have off-color portion or liquid streaks which indicates incomplete mixing. EB-347 employs a different color for the resin and hardener allowing for operators to easily tell if the product is completely mixed. With a white resin and a green hardener, EB-347 is a light green product. EB-347 can cure at room temperature or with heat. In aerospace applications, it is used for wire bonding in inertial systems, gyroscopes, and guidance systems for weaponry, fighter jets, and planes.

Creating hermetic seals is essential to ensure proper function of avionic and aerospace components. These components are essential in operations and failure can lead to catastrophic results. Hermetic are impervious to air and most gasses and are needed to create tight bonds between joints. EB-102F is designed as a general purpose, 2-part, epoxy adhesive especially useful for bonding dissimilar substrates. A room temperature cure adhesive, EB-102F has very high bond strength with internal flexibility preventing de-bonding of materials with different CTE values. EB-102F creates hermetic seals in inertial components such as gyroscopes and electro-mechanical assemblies.

The cost of thermal materials is very dependent on the type of filler, the amount of filler, and the other unique qualities of the adhesive. While there several low cost, thermally conductive adhesives available from Epoxyset, certain unique, high performance adhesives may cost more but also deliver much more. EB-403-1-ALAN is a unique, high performance adhesive incorporating a blend of highly conductive fillers. EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 WmK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding.

EB-350-3LV is a one component epoxy encapsulant intended for applications requiring excellent handling properties. The cured epoxy survives thermal shock and offers continuous service to over 220C. Specifically, EB-350-3LV is suited for use on transistors and similar semiconductors. It can be used for encapsulation of watch ICs. EB-350-3LV is also used extensively in ferrite core bonding due to its excellent strength, high temperature resistance, and ease of use.

Resistance to moisture is essential characteristic of epoxies. Due to the chemical nature of epoxy itself, moisture can lead to acidic formations resulting in decreases performance and bond strength over time. Most epoxies have very good moisture resistance however, in the aerospace and defense industries some applications call for an extremely high resistance, less than 0.02%. EB-108 is a two part, room temperature curing, low shrinkage epoxy. When cured properly, EB-108 has extremely low moisture uptake resulting in long term high bond strength. Used heavily in guidance systems of weaponry, planes, and jets for its strength, ease of use, and non-corrosive properties, EB-108 is an essential part of aerospace component manufacturing.

Most 5 or 10 minute epoxies have very strong and foul odors. Many potential users shy away from these epoxies because of the smell. This is due to the mercaptun (sulfur) based curing agents which have a naturally strong odor. EB-701 offers the same fast cure and strong bond to a variety of substrates but does not have as strong of an odor. This thixotropic paste has a work life of 4-6 minutes and a fixture time of 10-15 minutes. Many users prefer EB-701 for its low odor and high strength.

Most structural adhesives, whether they are epoxies, urethanes, acrylates etc, most are have a CTE of below 40 ppmC. While this will do for most adhesive applications, aerospace applications call for the lowest CTE for outstanding performance in harsh environments. High temperature to low temperature and a fast change in pressure call for the highest strength epoxy that does not expand and contrast due to these drastic changes. Unlike standard low CTE epoxies such as 3M EC-2216 or Loctite Eccobond 285, EB-309 uses a specialized filler to achieve what standard products do not. EB-309 has a CTE of below 20ppmC and resists temperature of over 260C for short periods of time. Used extensively for sealing and joint bonds in aerospace inertial systems, EB-309 can be applied to any application looking for stability in fast changing environments. EB-309 is a low expansion epoxy used in electronics of aerospace and medical components. EB-309 is also an excellent sealant due to its crack resistant and moisture resistant properties.

We offer a comprehensive line of multifunctional resin systems that can bond, form composites, seal and isolate over a wide range of substrates. High performance and cost effective, these systems are engineered to deliver strength, durability, chemical resistance, and efficiency to your product. Our line offers the user a variety of physical and electrical properties that allow matching an adhesive with specific application parameters. Our structural adhesives are formulated to withstand severe impact and peel forces, while offering excellent chemical and temperature resistance. They improve product performance and aesthetics while reducing assembly time and cost. Epoxyset industrial adhesives are all available in easy to use cartridge systems.

While useful in many applications, one component epoxies can be very difficult to store. One of the issues is the latent curing agent quickly solubilizing and advancement of the system. Many engineers however choose one component systems for the high temperature use and high Tg. EB-115 is a 2 part, high Tg, high temperature epoxy that eliminates storage issues while still delivering high temperature capabilities. EPOXIBOND EB-115 has been used for over 15 years in electronic countermeasure systems in the aerospace industry. Its fast cure time and lack of odor allows for high efficiency and less health risks than traditional odorous epoxies. EB-115 is a high temperature epoxy with a maximum service temperature of over 230.

EB-177 is a USP Class VI certified epoxy adhesive and encapsulant. Used in a variety of medical and optical applications, EB-177 is a convenient 1:1 mix ratio and high temperature epoxy. Used in the medical industry for PZT lamination and as a matching layer for ultrasound transducers, EB-177 is a non-toxic and non-hazardous epoxy. It is also used in large potting applications for the electronics industry including potting small transformers and capacitors. EB-177 is a medical grade adhesive certified USP Class VI for biocompatibility.

A United States defense standard, often called a military standard, MIL-STD, MIL-SPEC, is used to help achieve standardization objectives by the U.S. Department of Defense. Defense standards are used to for interoperability and to ensure products can meet certain requirements for use. Specifics of defense standards, specifications, details etc. are vast and it is important vendors and users are aware of which part is being used and for what. EB-348 is used in a number of aerospace components for several applications including wire tacking, gasket sealing, and thread reinforcement. EB-348 cures at elevated temperatures up to 175C and meets NASA Outgassing Standards. EB-348 has extremely low CTE due to specialty fillers and cure profile. EB-348 forms an extremely strong bond to metals, rubbers, and glass.

EB-403-1 is a one component, highly filled, thermally conductive adhesive. EB-403-1 employs conductive fillers using different particle sizes which increases conductivity and decreases settlement. Studies show that significant decreases in the viscosities can be obtained using a two-component filler system which permits the use of higher filler loadings. The increase in the ratio of coarse filler to fine filler reduced the flexural strength of the castings and increased the rate of settling in the formulations. EB-403-1 is used as an adhesive in several electronics products including hybrid multi-chip modules, high temperature oscillators, and crystal and IC filters. It is used inhigh temperature crystal oscillator product platforms for extreme environment applications. Typical operating temperature range is from 55C to +200C but can go as high as 230C.

Many engineers, procurements specialists, and operators wonder what is a one component epoxy? A one component epoxy is simply an epoxy system with the curing agent premixed into the product. How come it doesnt cure right away? Most one component epoxy adhesives incorporate latent curing agents that only cure properly with an external catalyst such as heat. There literally hundreds of different types of curing agents and skilled formulators use these to create different products with different properties. Advantages of one component epoxies include high temperature operation, no mixing or weighing required, and continuous operational use. EB-403-1LV-T1 is a one component, thermally conductive epoxy adhesive. A highly thixotropic product, it does not run or sag at elevated temperatures and is designed to stay in place where applied. In the electronics industry, it is used to bond ferrite cores as well as drum core inductors. EB-403-1LV-T1 is a thermally conductive adhesive used in LED applications to dissipate heat away from high powered LEDs. EB-403-1LV-T1 can cure in minutes at 150C and withstand temperatures over 260C continuously.

Many engineers, procurements specialists, and operators wonder what is a one component epoxy? A one component epoxy is simply an epoxy system with the curing agent premixed into the product. How come it doesnt cure right away? Most one component epoxy adhesives incorporate latent curing agents that only cure properly with an external catalyst such as heat. There literally hundreds of different types of curing agents and skilled formulators use these to create different products with different properties. Advantages of one component epoxies include high temperature operation, no mixing or weighing required, and continuous operational use. EB-403-1LV-T1 is a one component, thermally conductive epoxy adhesive. A highly thixotropic product, it does not run or sag at elevated temperatures and is designed to stay in place where applied. In the electronics industry, it is used to bond ferrite cores as well as drum core inductors. EB-403-1LV-T1 is a thermally conductive adhesive used in LED applications to dissipate heat away from high powered LEDs. EB-403-1LV-T1 can cure in minutes at 150C and withstand temperatures over 260C continuously.

Epoxyset has a number of select Halogen freeadhesives used for environmentally sensitive manufacturing. Halogen free is defined as containing EB-350-4T is a toughened, one component epoxy system with a shelf life of 3 months at ambient temperatures (25C). Shelf life can be extended by storing at lower temperatures (0-10C). EB-350-3T is a thixotropic, non-sag epoxy ideal for screen printing applications. EB-350-4T is used highly in bonding ferrite cores for its high strength and ability to withstand solder reflow temperatures of up to 280C (536F). In semiconductor and PCB applications, EB-350-4T is excellent as a glob top encapsulant and dam material for dam-and-fill encapsulation.

5 minute epoxies are epoxy adhesiveencapsulant systems that begin to set after 5 minutes and can reach handling strength after 1 hour. They are great for general purpose bonding of glass, metals, ceramics, and wood but is it strong? EB-755, Epoxysets standard 5 minute epoxy, has bond strength of over 2000psi on aluminum and can reach over 3000psi in etched metals.

EB-403-1LV is a low viscosity version of EB-403-1 used to make it a dual function epoxy as an adhesive and potting compound. When used at temperatures of 40C 50C, EB-403-1LV can be used to pot small electronics. Highly filled and highly conductive, this product is used extensively in potting wound toroid inductors in small aluminum housings. EB-403-1LV is a thermally conductive adhesive used in LED applications to dissipate heat away from high powered LEDs and can cure in minutes at 150C. EB-403-1LV can withstand temperatures over 260C continuously.

Small, tightly packaged circuits and components generate excess heat that can affect the performance and reliability of electronic components. With a constant push to further compact electronic packaging, the need for thermally conductive adhesives used to dissipate unwanted heat is more essential than ever. Areas for miniaturization include mobile phones, computers and vehicle engine downsizing. EB-316TC-2 is a highly filled, thermally conductive epoxy adhesive in a convenient 1:1 mix ratio. It is a toughened epoxy with extremely high bond strength and high heat dissipation. With a thermal conductivity of 3.2 WmK, EB-316TC-2 is excellent for drawing heat away from electronic components. In LED applications, EB-316TC-2 is used as an environmental seal and thermal management on the LED. In aerospace applications, EB-316TC-2 is used as a sealant for gyroscopes in guidance systems.

Epoxies, silicone, urethanes and many other polymer adhesives have a documented and stated viscosity which is an indicator of how thick or thin the material. While viscosity is a bit more complex than that, it is still a good way to gauge whether the material will flow properly for your application. There are a few different ways of reducing viscosity in the field or on the production floor. The easiest way is to add a small amount of heat. Because viscosity is heat dependent, heating the material lowers viscosity. Heat also affects the work life so that must be taken into account when deciding. Another option is adding solvents or diluents to the epoxy such as MEK or high flash naphtha. Please contact Epoxyset before adding to make sure the solvent or diluent is compatible with the product. EB-350-1LV-M2 is a low viscosity, general purpose one component epoxy. EB-350-1LV-M2 is used commonly for a variety of applications including potting, encapsulating, underfill, and dielectric layering. With a room temperature viscosity of about 25, 000cps, it is ideal for automated dispensing as well as manual use. EB-350-1LV-M2 can be heat slightly to reduce viscosity and is compatible with certain solvents. Epoxyset also offers reactive diluents (non-solvent) which can also reduce the viscosity. Specific uses for this product include potting small electronic components such as capacitors and transistors.

EB-470 is a thermally conductive, high temperature epoxy adhesive specially designed for heat sink attachment. In electronics, heat sinks are passive heat exchangers that cool a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool CPUs and graphics cards. In optoelectronics such as lasers and LEDs, heat sinks are used to moderate operating temperature. EB-470 is a thermally conductive adhesive used improve the heat sinks performance by filling air gaps between the heat sink and the device. EB-470 can be screen printed, machine dispensed, stamped, or manually applied. It has a very long work life of over 6 hours and cures within minutes at temperatures above 150C.

EB-403-1 is a one component, highly filled, thermally conductive adhesive. EB-403-1 employs conductive fillers using different particle sizes which increases conductivity and decreases settlement. Studies show that significant decreases in the viscosities can be obtained using a two-component filler system which permits the use of higher filler loadings. The increase in the ratio of coarse filler to fine filler reduced the flexural strength of the castings and increased the rate of settling in the formulations. EB-403-1 is used as an adhesive in several electronics products including hybrid multi-chip modules, high temperature oscillators, and crystal and IC filters. It is used inhigh temperature crystal oscillator product platforms for extreme environment applications. Typical operating temperature range is from 55C to +200C but can go as high as 230C.