Epoxy Adhesives #5216754

Medical grade epoxy is used in a variety of application is medical device assembly. Many of our medical adhesives are tested for biocompatibility to ensure safety for human contact. Medical devices that use medical epoxies include MRI machines, cardiac catheters, medical probes, and ultrasounds. Adhesives are universally used for bonding cannulae to hubs in needle assemblies. It is critical that this joint is well sealed to prevent fluids, such as blood or medicine, from leaking. For these applications, one-part heat cure epoxy adhesives are the lowest cost options with the best chemical resistance. Other types of adhesives include light cure acrylates and cyanoacrylates. Many of Epoxyset medical epoxy systems are USP Class VI certified for biocompatibility.

Electromagnetic interference (EMI) is disturbance that affects an electrical circuit emitted from an external source. The disturbance may degrade or limit the effective performance of the circuit.EMI shielding is the practice of blocking out electromagnetic interference by reducing the electromagnetic field in a space. This is done by using conductive or magnetic materials. EMI shielding includes coatings, gaskets, enclosures, sealants, and resins. EO-21M-5 is an electrically and thermally conductive epoxy adhesive. It has an very low viscosity for a silver filled system and can be used in coating and sealing for EMI and Rf shielding. EO-21M-5 is also used for die attach or substrate attach for Rf and microwave devices. EO-21M-5 is used in die attach for electronic components in spinning-mass inertial sensors for extreme thermal dissipation for high powered LEDs

EO-30M-1 is one of Epoxysets most used electrically conductive epoxy. It is a room temperature cure and an attractive option for components that cannot withstand temperatures of heat cure epoxies. Although room temperature cure epoxy is a widely used option, care must be taken with silver filled materials. Temperature fluctuation can play a significant role in cure speed and cross-link density. Effects on cross-link density change the conductivity and resistivity of the material. Humidity is also important to control as increased humidity leads to amine curing agents to migrate to the surface resulting in uncured material and an improper mix ratio. Improper mix ratios can severely affect the polymer in its mechanical strength, outgassing, and conductive ability. EO-30M-1 has been specially formulated to help reduce the risk of environmental fluctuation on the cured material. While it does not eliminate the risk, EO-30M-1 is less sensitive to temperature variability to its cured properties. EO-30M-1 can cure in 24 hours at temperatures as low at 20C and can obviously be cured using heat as well. EO-30M-1 is an ideal product for solderless electronic components as well as thermal interface management. It can be used for die bonding onto ceramic PCB as we

Why is silver filled epoxy preferred over gold? Gold presents several issues such as cost, variety, and demand. Gold filled epoxy is over 20 times more expensive than standard silver filled epoxies at over $85gram. For many applications using gold filled epoxy may be intriguing and possibly useful but the price eliminates the option. Next is the variety of silver filled systems. Epoxyset offers a variety of silver filled epoxies with different viscosities, work lives, and cured properties. Gold filled epoxies all tend to be high viscosity, paste products due to its high oil absorbency and lack of particle size distribution. Finally, the demand for the properties of gold filled epoxy is very low. Only very specialized applications call for them and will not work without the use it. EO-23M is highly filled, thermally and electrically conductive epoxy adhesive that can cure at room temperature and is used in aerospace, electronics, and medical applications. In aerospace guidance systems where there are high performance standards, EO-23M is used for EMI and Rf shielding to prevent electronic malfunction. EO-23M is used in the electronics of automotive applications for pressure sensing and accelerometer components. It is also an eelectrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna applications such as smart cards and RFID tags.

EO-97M is a one component, silver filled epoxy adhesive that has a wide range of cure profiles. Needing a recommended minimum temperature of 80C, it would take several hours to cure but may help prevent damage to sensitive components. It is also possible to snap cure EO-97M. What is snap cure? Snap cure is simply to cure the adhesive very quickly at very high temperatures. This generally leads to higher shrinkage than lower temperatures but this can be advantageous for electrical and thermal conductivity by increasing contact of conductive fillers. Snap cure is also beneficial in operation for efficiency and high output. EO-97M is used to bond metals, ceramics, rubbers, and certain plastics used in electronic parts. Typical applications include bonding surface mount devices to flexible or rigid substrates, bonding of semiconductor elements; joining EMI and Rf parts; bonding electrodes, lead wires, and other connectors. EO-97M is used on electronic lead wires in military Doppler radars.

For years, leadtin soldering has been widely used to make electrical connections in electronic components. During the soldering process, the components are subjected to very high temperatures and many sensitive components can be damaged at extreme temperatures. Also, in recent years there has been a push to replace lead materials due to its harmful environmental impact and toxic nature. In certain solder applications, electrically conductive epoxy has become a highly regarded alternative. EO-24 is a high temperature, electrically conductive epoxy used as a solder replacement in many applications. Its low viscosity but thixotropic nature makes it ideal for screen printing and die attach applications. Very versatile on the production floor, EO-24 can be cured in less than 1 minute at 175C. Many different curing methods can be employed including tunnel ovens, heat guns, infrared tunnels, or inductor coils. In opto-electronic packaging applications, EO-24 is used to die attached LED chips to substrates in single chip packages or arrays. EO-24 meets NASA outgassing standards when cured properly and can be used in Rf and EMI shield

Used as an alternative to AI Technology ME8452-A, EO-98HT is used highly in snapcuring applications. This highly silver-filled epoxy paste adhesive is solvent free, re-workable, and electrically and thermally conductive. With outstanding strengthfor bonding materials with highly mismatched CTEs (i.e. alumina to aluminum, silicon to copper). EO-98HT can be easily reworked at elevated temperatures(80 to 100 C) and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTEs. Both viscosity and thixotropic index makes it screen printable, automated, or dispensed manually. EO-98HT is available in various size syringes for automatic needle dispensing applications or in bulk sized jars.

EO-32 is a highly filled, heat cure epoxy adhesive with an extremely low volume resistivity of 0.0003 ohm-cm. Volume resistivity is a quantified value that measures resistance of electrical flow. A low resistivity indicates a free flow of electrical charge (electrically conductive). Electrically conductive epoxies always have low volume resistivity values and are easy for end users to test to see if it is conductive enough for the application. EO-32 is a high heat, electrically conductive epoxy adhesive used primarily in die attach of LED single chips or arrays to PCB. EO-32 can cure in minutes at temperatures above 150C and can withstand solder reflow of up 260C. In extremely high powered LED, EO-32 can be used as the thermal interface to dissipate heat away from the LED. EO-32 is a two part system but is preferred in premixed and frozen syringes due to its long work life and high viscosity. It is ideal for automation and screen printing applications.

A fast curing, 1:1, conductive epoxy, EO-30FST is the answer to quick fix and repairs for electrical connections. It is used to make conductive bonds between heat sensitive connections and make solder repairs. In small masses (10-15 grams), EO-30FST sets up in less than 20 minutes. Used extensively in solderless surface mount connections, EO-30FST can be used at temperatures up to 100C. This product bonds aggressively to a wide range of materials, cures in 8 hours at room temperature, or more quickly when heat is applied to bond and the cured material typically has resistivity as low as 0.001 ohm-cm. Used a lot in aerospace guidance systems for field repair connections and solder repairs due to its fast set up and cure without heat.

Die attachment is the step in integrated circuit packaging during which a die is mounted and fixed onto the chip carrier (package or another die). Electrically conductive epoxy adhesives are generally used in this process due to its strong bond strength of components onto printed circuitry. Applications used for epoxy die attach include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids. EO-21 is a two-component, silver filled, electrically conductive epoxy. Used extensively for die attach applications, EO-21 has excellent bond strength of the die to various substrates. A highly filled epoxy, EO-21 offers outstanding volume resistivity of

Silver is a popular choice as electrically conductive filler due to its high conductivity, easy loading, and widespread availability. Silver based conductive adhesives can be expensive but most companies find the performance and properties of our silver filled adhesives to be worth the costs. Cheaper options are nickel, graphite, or silver coated materials which may work for some applications but also provide half the thermal and electrical conductivity. We provide a wide range of epoxies and believe silver filled epoxies satisfy the widest range of electrical needs. EO-38M-3 is over 70% filled with fine silver and is formulated as an easy 1:1 mix ratio. EO-38M-3 is used in the photovoltaic industry to replace solder joints of copper to tin ribbon wire as well as a high performance heat sink on thermal substrates. In medical devices, EO-38M-3 is used to die attach photo diodes in X-ray circuits. EO-38M-3 is a two component system but is also ava

EO-82M-2 is a one component system designed as a conductive thermosetting silver preparation for screen printing applications. Its composition is unique, providing high electrical and thermal conductivity with excellent bond strength after appropriate cure. EO-82M-2 epoxy is used as an advantage in place of lead-tin solders to avoid flux contamination or exposure to excessive temperature and for process simplification by screening on contacts. By creating ohmic contacts, EO-83M-2 bonds withdoped semiconductors or if the surface of the semiconductor is metallized. The product finds extensive use in bonding semiconductor chips, integrated monolithic circuits, diodes, transistors and other components in thin film and thick film hybrid microelectronic circuits. It bonds to glass, mica, plastic, graphite, quartz and other materials as well. EO-83M-2 is stable for over 1 month without significant rise in viscosity. This can be extended if stored at temperatures below 0C.

Epoxyset EO-84M-1T is a silver-filled conductive adhesive offers excellent electrical and thermal conductivity. It is designed for use with automated dispensing, stamping and screen-printing application equipment. EO-84M-1T adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications. EO-84M-1T has a shelf life of 30 days at room temperature but can be extended by storing at 0C and below.