Other Products / Services #5216307

We produce braze alloys for microelectronic packaging and high temperature joining of vacuum electronic devices. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms including ribbon, wire, preforms and powder. Materion manufactures ultra clean braze alloys with base metals free of contamination that produce joints of high integrity and strength. Available in: Pure metals and alloysPrecious metals and alloysLead-freeAuSn in 8020 and 7822Variety of shapes - squares, rectangles, dish, washers, frames

Copper Aluminum Dovetail Clad is a breakthrough technology for joining copper and aluminum side-by-side in long continuous master coils. These coils can easily be stamped and formed to create busbars or lead tabs, enabling high-volume, low-cost laser assembly especially fitted to automotive format lithium-ion battery packs. Based on nearly 50 years of expertise in cladding aluminum to copper for high-reliability automotive lead frame applications, Materion Technical Materials has taken their state-of-the-art metal cladding technology to a new level to meet the challenges facing every lithium-ion battery cell and pack designer: how to join copper and aluminum in your battery pack. To learn how our Copper-Aluminum Dovetail Clad Metal Technology enables laser welding in your battery pack,

MoldMAX is tailored for all types of plastic injection molds. With excellent machinability and high impact strength, these alloys allow easy fabrication of molds that stand up in the plastic injection molding process.With a unique combination of strength and thermal conductivity, MoldMAX alloys improve cycle time and part quality, even when used for only selected cores and inserts. When used in steel molds, MoldMAX cools hot spots, reducing or eliminating the need for cooling channels. By minimizing the temperature differences of mold parts, MoldMAX provides tighter molded tolerances and less post-mold shrinking or warping.

Rarely does a single alloy offer the range of diverse properties required by todays sophisticated electronic and electrical applications. Materion's clad metal process, electron beam welding, electroplating and related technologies offer designers the flexibility to meet todays performance challenges. Metal cladding, the process of joining dissimilar metals by applying high pressure without brazing alloys or adhesives, creates a material custom-engineered to the application. Because of our experience with virtually every base metal and cladding combination, we are able to help our customers optimize surface and core metal characteristics. At Materion we dont have a catalog of products; we create innovative custom solutions for global market leaders. We design materials, fabricate prototypes, and get samples into your hands quickly with the primary focus always being quality and performance.

GETTER COMBO-LIDS - COMBINING GETTER TECHNOLOGY WITH COVER LIDFor high reliability applications, certain GaAs electronic devices, MEMS devices and other sensitive sensors must be hermetically packaged with a sealed cavity completely free of hydrogen or all gases. Hydrogen degrades the long term reliability of GaAs devices. Many MEMS devices require vacuum for proper performance.

Epoxy with strong reliable adhesion for your non-hermetic applications, especially in combination with our Epo-Lids. MEG 150 It is typically used to bond cup-shaped ceramic caps onto ceramic packages for RF transistors. MEG 165 is optimal for sealing smooth, flat surfaces and serves as a low cost alternative to solder. Both are excellent electrical insulators, and protect electrical components from short circuiting, dust and moisture. For more information, see our Technical Data Sheets MEG 150 and MEG 165.

Our customized infrared filters enable accurate gas detection or create an enhanced thermal image. We can pattern or bond multiple filters into an array, thus providing a variety of filters and coatings to meet your requirements. CONTACT US! We are the go-to supplier for precision optical filters. THE MATERION ADVANTAGEOur infrared filters detect gases that have a signature in the IR spectrum from NIR through 40 microns and can protect IR detectors from harmful light waves. Applications range from flame & gas detection, automotive night vision, thermal imaging, thermography, to mechanical housings & assemblies for hermetic packaging.

Hermetic lids for every application designed to protect your heat sensitive electronics. We customize solder, plating & clad properties to your individual requirements. CONTACT MATERION! WHEN YOU NEED HIGHLY RELIABLE HERMETIC SEALING - WE'VE GOT YOU COVERED! THREE OF OUR CUSTOMZIED LIDS & SPECIFICATIONSMicro-Lids Designed for a microelectronic package with area 0.300 in or lessDue to small size, capillary action pulls liquid solder to perimeter during reflowBase metal is Kovar or Alloy-42 for high performanceA42 is plated with several layers, including 35-50 micro-inches of goldHighly corrosion resistant for maximum protectionAn economic cost alternative to our traditional Combo-Lid, but with the same qualitySeam Seal-Lids Known as an electroless Ni plated lidBase metal is Kovar or Alloy 42 for high performanceA42 is plated with 50-200 micro inches of electroless nickelHighly corrosion resistant for maximum protectionVast tool library built to stamp lids in a variety of sizes and shapesTypical dimensions for standard lids range from .250 square to .060 squareSolder Reflow-Lids A smaller lid composed with non-precious metal soldersAn economic cost alternative to our traditional Combo-Lid, but with the same qualityTypically used for lids that measure less than .200 X .200Solder coverage controlled to the lid edge, so it easily passes gross leak testsCan be adjusted to accommodate lead-free solders

Our solder & braze powders deliver high temperature solutions for your microelectronic packaging requirements.Available in a wide range of solderbraze alloys, including precious metals, and in a variety of sieve and mesh sizes to meet your needs. Our exceptional spherical shaped particles and total impurity levels below 100 ppm, provide superior vacuum joining of electronic devices. View our Charts of Available Powders and Brazing Alloys for more information.

Hermetic lids to meet your microelectronic packaging requirements whether for the semiconductor, MEMS, medical or optical market. Our product line encompasses a full range of lids that can be customized to your specific application. View our lid application comparison chart. Available lids include: Combo-Lids - for high reliability applicationsMicro-Lids - for packages smaller than .300 in2 Seam Seal-Lids - for sealing heat sensitive electronicsSolder Reflow-Lids - a cost alternative to the Combo-Lid Visi-Lids - for optical packagesNon-Magnetic Lids - for specialty applicationsCeramic Combo Lids - for specialty applicationsEpo-Lids - Epoxy-coated ceramic for commercial application

CERAMIC PACKAGINGRF and microwave packages for use with a wide variety of RF power transistors and MMICs, including transistors fabricated in Si, GaAs and GaN. As a leading innovator of ceramic packages, we can meet your demands for very low thermal resistance and very low RF loss. Our product line includes: Ceramic Air Cavity PackagesCuPACKSPlated Flanges

Our packages for discrete Si, GaAs and GaN RF power transistors offer proven performance & reliability for wireless applications in the 500 MHz to 3.5 GHz frequency range. Our ceramic air cavity packages feature the following to deliver a consistently high-performing product: High thermal conductivity flange promotes low thermal resistanceAlumina ring frames provide very low dielectric loss at RF frequenciesLeads are Alloy 42, plated with Ni and Au to provide superlative electrical conductionBrazed construction provides excellent mechanical reliability

Our filter arrays enhance system performance while reducing size and weight enabling our customers to miniaturize their systems and lower costs. CONTACT US for superior spectral performance in defense, space & commercial optical applications. THE MATERION ADVANTAGEThe combination of our innovative optical filter manufacturing technology, along with our precision microlithography and dicing capabilities, allows us to produce filter assemblies or patterned arrays with these benefits: Wide spectral rangeCapture more than one transmission band with a single optical elementMounted directly above the focal plane of a detectorProduced to meet any size or weight limitationsVery fine pitchCryogenic or ambient operationSpace qualifiedStray light reductionWhether your requirement is for imaging, carbonation detection, color matching, threat warning or other applications, our filter arrays and assemblies can be tailored to meet your needs.

Materions proprietary plating process produces flange surfaces that are free of pits, scratches and other defects, thus solving one of your major quality challenges. Our superior quality flanges are plated with Ni:Co + Au for high-performance use in RF transistors, FETs and MMICs. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC)Our flanges are plated with electrolytic nickel, copper and gold for reliability and are compatible with AuSi eutectic die attachOur advanced material custom plated flanges accommodate multiple applications to meet your microelectronics device requirements.

Whether you require multiple coatings on a single substrate, or patterned features on virtually any shape optic, we are your go-to supplier. CONTACT US! Materion is a global leader in precision optical filters and thin film coatings. THE MATERION ADVANTAGEOur optical coatings can be deposited and customized to create exactly the pattern you need. Other benefits include: Exceptional quality and durabilityHigh and low temperature patterning accommodates all coating processesThick and thin resists to provide for thick or thin coatingsFront to back substrate alignmentSmall feature sizes over large areasPositive and negative resists

When you need cover lids for high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids can function in the harshest service environments. Top of Combo Lid Illustration The base metal of our high performance Combo-Lids is Kovar or Alloy 42, which is plated with nickel and gold flash, and tack-welded to a solder perform, usually AuSn eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, Hermetic Combo-Lids offer a best-cost solution.

Materion now offers a variety of zirconium based bulk metallic glass alloys (BMGs). Also referred to as amorphous glass forming alloys, the Vitreloy product line includes Vit1b, Vit105 and Vit106a. With our expertise in vacuum melting and other processes critical to metallic glass production, we provide the highest quality alloys in commercial quantities.

Our uniform silver-based alloys are available in a variety of forms including strip, wire, thin foils and wide-width sheets. They can be used in a range of silver brazing processes including torch, furnace, vacuum and inert gas atmosphere. Consult our SilSeal Comparative Chart of brazing materials for more technical information.

Materion offers a range of innovative technologies to support low defect wafer coating. Our photolithography processes enable precise application of a variety of optical & non-optical thin films for challenging applications.

Materials with low impurities & minimal surface contamination. Whether ion-assisted, E-beam or thermal evaporation, our purity achieves low spit rates.

Our tightly controlled, high purity materials are responsible for consistent, reproducible performance and exceptionally uniform coatings.