PVA Tepla America, Inc.

GIGAbatch Series Microwave Plasma Systems Microwave Batch Ashing Plasma Systems Models 310M, 360380 M, 360380 P, A 360380 P The GIGAbatch series is the latest and most advanced generation of MW batch ashers offered today and is the successor of the very popular Tepla 300 series. These are used extensively for photoresist ashing, descum, wafer cleaning, and silicon nitride etching. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products. Starting at very economic prices, the systems range from R&D tools to fully-automatic systems for high-volume production in Waferfabs up to 200mm. These Batch Plasma systems are can process all wafer sizes up to 6"for Gigabatch 360 and up to 8" Gigabatch 380. All models feature the hands-free door opening system for easy loading and unloaded.

USED Gigabatch 360 Microwave Plasma System The GIGAbatch series is the latest and most advanced generation of MW batch ashers offered today and is the successor of the very popular Tepla 300 series. These are used extensively for photoresist ashing, descum, wafer cleaning, and silicon nitride etching. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products For more details:

• Width of treatment band3 - 10 mm
• Standard Cable Length3 m - 6 m (9 - 18 ft.)

THE CLEANING POWER OF CO2 As a liquid or super critical fluid, CO2 has good solvent properties for removals of oils, greases and other common machining contaminants. Liquid CO2 (LCO2) has low surface tension and very low viscosity, which improves the likelihood that the solvent will wet the surface to be cleaned and penetrate into small crevices and blind holes. For certain contaminations, CO2 is useable with bio-based washing agents for increased cleaning power. In addition, LCO2 is an effective dry rinsing agent. The CO2 cleaning process can meet a variety of cleanliness requirements, ranging from visually clean and microscopically clean to total mass loss (TML), scanning electron Microscopy (SEM) and even acoustic microscopy (AM). CO2 possesses a unique cleaning solvent scheme which can be applied to many different types of challenging (and more general) device cleaning applications such as:

• Width of treatment band3 - 10 mm
• Service Interval1500 hours (gas

The GIGAfab A is a compact, high-performance, automatic Single Wafer Asher. It is designed to serve main stream semiconductor photoresist stripping, esp. hi-dose implanted resist, MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications like: • Resist removal and descum in wafer bumping • Sacrificial layer removal of photoresist, polyimide, PMMA etc. • Fast resist ashing after high-dose implant and RIE • 300 mm wafer reclaim • Removal of SU-8 epoxy resist