PVA Tepla America, Inc.

United States

Highlights:For any tubes, cables, and wires up to 4 mmdiameterFull 3600 treatmentNo damage to thin insulatorsHighly effective, gentle treatmentLow costCompact designSimple operationPre-coating process suitable for any type ofInk-Jet or other printing-method

This Compact, Bench top vapor deposition system is ideally suited for Research and Development laboraties and pilot production. Typical Applications Silane Surface ModificationMEMS AntiStiction layersSemiconductor fabrication and Packaging coatingsBiocompatible surfacesHydrophilic fluidic filmsHydrophobic protection filmsAdhesion promotersAtomic Layer Deposition (ALD) of inorganic oxidesProcess Control Accurate precursor delivery with Labview creates superior monolayers. This surface modification is achievedby precise chemical dosing, or by easy sequential and alternating programming.ISTs open architecture allows users to create novel nanocomposite structures.ISTs cartridge design* provides easy chemical changeover for multiple applications in the same system.

THE CLEANING POWER OF CO2 As a liquid or super critical fluid, CO2 has good solvent properties for removals of oils, greases and other common machining contaminants. Liquid CO2 (LCO2) has low surface tension and very low viscosity, which improves the likelihood that the solvent will wet the surface to be cleaned and penetrate into small crevices and blind holes. For certain contaminations, CO2 is useable with bio-based washing agents for increased cleaning power. In addition, LCO2 is an effective dry rinsing agent. The CO2 cleaning process can meet a variety of cleanliness requirements, ranging from visually clean and microscopically clean to total mass loss (TML), scanning electron Microscopy (SEM) and even acoustic microscopy (AM). CO2 possesses a unique cleaning solvent scheme which can be applied to many different types of challenging (and more general) device cleaning applications such as:

The GIGAfab A is a compact, high-performance, automatic Single Wafer Asher. It is designed to serve main stream semiconductor photoresist stripping, esp. hi-dose implanted resist, MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications like: Resist removal and descum in wafer bumping Sacrificial layer removal of photoresist, polyimide, PMMA etc. Fast resist ashing after high-dose implant and RIE 300 mm wafer reclaim Removal of SU-8 epoxy resist

The PlasmaPen is a patented atmospheric plasma system used to solve surface preparation problems. The PlasmaPen produces high density plasma with a low heating effect, giving it the ability to clean and activate the surfaces including low melting point polymers. Our worldwide customer base uses the PlasmaPen for a broad range of applications that span the Life Science, Electronics and Industrial markets. The PlasmaPen cleans and activates the surface of materials promoting wettability of potting compounds, adhesives, inks, paints and dyes. Surface cleaning with the PlasmaPen ensures reliable wire and die bonding for semiconductor packaging. It has shown particular success in adhesion promotion of anisotropic conductive film (ACF) used in flat panel display manufacturing. The patented design of the PlasmaPen keeps voltages and current safely away from the plasma jet. This means that the user is not exposed to potentially dangerous voltages and surfaces are not subjected to damaging filamentary discharges. The PlasmaPen can be used manually or remotely through host automation. It is ideally suited to in situ treatments enabling rapid in-line processing, eliminating any activation lifetime issues. Process gasses are flowed through the pen, activated and ejected through the nozzle. PVA TePlas design allows compressed air to be the standard treatment gas for most applications and provides for a very low cost of ownership. Other gasses can be utilized depending on the specific application.

The RoboPen is an automated version of the patented atmospheric PlasmaPen. The RoboPen is used to prepare surfaces by cleaning and activating materials such as polymers, glass, ceramics, metals, etc. for a broad range of applications spanning Life Science, Electronics and Industrial markets. Surface cleaning with the RoboPen ensures reliable wire and die bonding in semiconductor packaging, and has shown particular success in adhesion promotion of anisotropic conductive film (ACF) used in flat panel display manufacturing. The RoboPen increases the surface energy of materials promoting wettability of potting compounds, adhesives, inks, paints and dyes. The RoboPen is a self-contained, automated atmospheric plasma treatment system that can be configured andor customized to meet a broad variety of manufacturing applications. PVA TePla works with a number of robot manufacturers in order to offer our customers a complete range of custom automation solutions. We provide any range of options starting with a basic table-top XYZ model up to the most complex multiple axis, vision recognition and high speed pick and place solution. Our product range allows customized programming and integration into any manufacturing line concept and we are able to partner with any customer preferred Robot Manufacturer. Process gasses are flowed through the PlasmaPen assembly, activated and ejected through the nozzle. PVA TePlas design allows compressed air (CDA) to be the standard treatment gas for most applications and provides for a very low cost of ownership. Other gasses can be utilized depending on the specific application.

USED Gigabatch 360 Microwave Plasma System The GIGAbatch series is the latest and most advanced generation of MW batch ashers offered today and is the successor of the very popular Tepla 300 series. These are used extensively for photoresist ashing, descum, wafer cleaning, and silicon nitride etching. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products For more details:

The precision basic instrument for wetting investigations The KRSS Drop Shape Analyzer DSA25 is an easy-to-use, reliable instrument for measuring contact angle. From a simple wetting test to the accurate measurement of surface free energy, the robust instrument provides flexible options for analyzing wetting and adhesion on solid surfaces. Its rapid, manual operation makes our DSA25 outstandingly suitable for occasional wetting measurements with changing tasks and sample types. Tasks and applications Characterization of surface pre-treatment processesChecking the wettability of plastic, glass, ceramic, wood or metalChecking surface cleanliness

GIGAbatch Series Microwave Plasma SystemsMicrowave Batch Ashing Plasma SystemsModels 310M, 360380 M, 360380 P, A 360380 P The GIGAbatch series is the latest and most advanced generation of MW batch ashers offered today and is the successor of the very popular Tepla 300 series. These are used extensively for photoresist ashing, descum, wafer cleaning, and silicon nitride etching. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products. Starting at very economic prices, the systems range from R&D tools to fully-automatic systems for high-volume production in Waferfabs up to 200mm. These Batch Plasma systems are can process all wafer sizes up to 6"for Gigabatch 360 and up to 8" Gigabatch 380. All models feature the hands-free door opening system for easy loading and unloaded.