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RM

Robert McKeown Co., Inc.
location United States

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Gaskets And Gasket Material

We offer a complete product range of Low Closure Force EMI Gaskets - Selector Guide, 3500 Low Closure Force EMI Strip Gaskets - Stealth Profiles and 3500 Low Closure Force EMI Strip Gaskets - Rectangle Profiles

Low Closure Force EMI Gaskets - Selector Guide

  • Product Forms SQ, REC., D and Custom
  • Foam High Performance Silicone Foam
  • UL Rating UL 94 V-0
Soft Shield commercial-grade EMI gaskets are designed for shielding and grounding in today's commercial electronic enclosures. They consist of an electrically conductive fabric jacket over a highly compressible urethane foam core. Nickel-plated-silver, woven nylon rip-stop jacket is self-terminating when cut. A broad range of highly compressible profiles are available as strips or kiss-cut parts, in both UL 94V-0 and General Duty versions. Pressure-sensitive adhesive attachment tape is provided
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3500 Low Closure Force EMI Strip Gaskets - Stealth Profiles

  • Profile Number 3823
  • Height 0.100 in 2.54 mm
  • Width 0.394 in 10.0 mm
  • Softness Best
The SOFT-SHIELD 3500 fabric over foam (fof) product family are a group of low-closure force EMIEMC gaskets. SS3500 offers a low cost competitive solution for EMI shielding and electrical grounding in sheer and compression. The SS3500 product family is comprised of conductive fabric wrapped around open cell foam. This wrap around technology grounds the gasket from point to point, ultimately eliminating an EMIEMC gap.
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3500 Low Closure Force EMI Strip Gaskets - Rectangle Profiles

  • Height 0.079 in 2.0 mm
  • Width 0.118 in 3.0 mm
  • Compression Set < 15 %
The SOFT-SHIELD 3500 fabric over foam (fof) product family are a group of low-closure force EMIEMC gaskets. SS3500 offers a low cost competitive solution for EMI shielding and electrical grounding in sheer and compression. The SS3500 product family is comprised of conductive fabric wrapped around open cell foam. This wrap around technology grounds the gasket from point to point, ultimately eliminating an EMIEMC gap
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