Other Products / Services #4931383

Long-term, reliable protection of sensitive circuits and components is becoming more important in many of todays delicate and demanding electronic applications. Silicones function as durable dielectric insulation, as barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range. In addition to sustaining their physical and electrical properties over a broad range of operating conditions,

Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
Functioning as dielectric insulation
Protecting the circuit from moisture and other contaminants
Relieving mechanical and thermal stress on components

THERM-A-GAP gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces.

FeaturesBenefits
Ultra low deflection force
High thermal conductivity
High tack surface reduces contact resistance
"A" version offers high strength acrylic PSA for permanent attachment
UL recognized V-0 flammability
RoHS compliant

CHO-THERM Commercial Grade Thermal Insulator Pads are designed for use where solid thermal and electrical properties are required at an economical price. These products are offered as dry pads, or with an optional adhesive (PSA) layer for attachment. Materials with PSA are available die-cut on continuous rolls. Versions are offered with either polyimide or fiberglass reinforcement to protect pads against tear, cut-through and punctures.

Chomerics CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring

T418 is the latest offering in Chomerics line of industry-leading thermally conductive attachment tapes. Chomerics has utilized its world-class materials science expertise and decades of applications development experience to create this superior product, offering exceptional thermal and mechanical attachment properties.

THERMFLOW materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DCDC converters and power modules.