Our Complete range of products are Silicone Potting, Dow Corning Dielectric Gel Kit, THERM-A-GAP - Thermally Conductive Gap Filler Pads, Comercial Grade Thermally Conductive Electrical Insulator Pads and CHO-FOIL Conductive Tapes.
Long-term, reliable protection of sensitive circuits and components is becoming more important in many of today’s delicate and demanding electronic applications. Silicones function as durable dielectric insulation, as barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range. In addition to sustaining their physical and electrical properties over a broad range of operating conditions,
Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by: Functioning as dielectric insulation Protecting the circuit from moisture and other contaminants Relieving mechanical and thermal stress on components
THERM-A-GAP™ gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces. FeaturesBenefits Ultra low deflection force High thermal conductivity High tack surface reduces contact resistance "A" version offers high strength acrylic PSA for permanent attachment UL recognized V-0 flammability RoHS compliant
CHO-THERM® Commercial Grade Thermal Insulator Pads are designed for use where solid thermal and electrical properties are required at an economical price. These products are offered as dry pads, or with an optional adhesive (PSA) layer for attachment. Materials with PSA are available die-cut on continuous rolls. Versions are offered with either polyimide or fiberglass reinforcement to protect pads against tear, cut-through and punctures.
Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring
Soft Shield commercial-grade EMI gaskets are designed for shielding and grounding in today's commercial electronic enclosures. They consist of an electrically conductive fabric jacket over a highly compressible urethane foam core. Nickel-plated-silver, woven nylon rip-stop jacket is self-terminating when cut. A broad range of highly compressible profiles are available as strips or kiss-cut parts, in both UL 94V-0 and General Duty versions. Pressure-sensitive adhesive attachment tape is provided
The SOFT-SHIELD® 3500 fabric over foam (fof) product family are a group of low-closure force EMIEMC gaskets. SS3500 offers a low cost competitive solution for EMI shielding and electrical grounding in sheer and compression. The SS3500 product family is comprised of conductive fabric wrapped around open cell foam. This wrap around technology grounds the gasket from point to point, ultimately eliminating an EMIEMC gap.
The SOFT-SHIELD® 3500 fabric over foam (fof) product family are a group of low-closure force EMIEMC gaskets. SS3500 offers a low cost competitive solution for EMI shielding and electrical grounding in sheer and compression. The SS3500 product family is comprised of conductive fabric wrapped around open cell foam. This wrap around technology grounds the gasket from point to point, ultimately eliminating an EMIEMC gap
T418 is the latest offering in Chomerics’ line of industry-leading thermally conductive attachment tapes. Chomerics has utilized its world-class materials science expertise and decades of applications development experience to create this superior product, offering exceptional thermal and mechanical attachment properties.
THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DCDC converters and power modules.