Our Products #4817844

COOLSPAN Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings.

Thermally robust & lead-free solder compatible
Low flow during pressure cure
Bonds RF PCBs to heat sinks, pallets and housings
Features

Thermally and Electrically Conductive Bond Interface
Supplied on PET Carrier on PET carrier
Low Flow During Pressure Cure
High Bond Strength & Thermally Robust
Lead-free Solder Compatible and Chemically Resistant

92ML Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics for multilayer PWB's for applications requiring thermal management throughout the entire board volume. ML Series laminates are also offered in combination with a metal plate as a mechanical chassis and inteThermal Conductivity of 2.0 Wm-K in the Z-axis, 10x that of FR-4
Thermal Conductivity of 3.5 Wm-K in plane
Glass Transition Temperature >160C and CTE Z as low as 22 ppmC
Decomposition Temperature up to 350C
Coefficient of Thermal Expansion in-plane as low as 20 ppmC
Best-in-class Thermal Performance with T260 > 60 minutes, T288 > 30 Minutes and T300 > 10 Minutes
Electrical Strength of >1000 Voltsmil
Engineered for use with Metal Backing for Producing Metal-Clad PCBs
Certified to the Flammability Requirements of UL-94 V0
Halogen-free per IPC-4101 Specifications, RoHS& WEEE Compliant
RTI Values as High as 170Cgral heat sink.

AD series PTFEwoven glass based laminates are designed for cost sensitive commercial applications and deliver consistent, high performance required of high frequency PCB materials.

This product series is offered with a dielectric constant range from 2.5 to 10.2, with loss tangent values ranging from 0.0014 to 0.003 @ 10GHz. This offers designers a broad range of products to meet demanding requirements for a variety of designs.AD series PTFEwoven glass based laminates are designed for cost sensitive commercial applications and deliver consistent, high performance required of high frequency PCB materials.

This product series is offered with a dielectric constant range from 2.5 to 10.2, with loss tangent values ranging from 0.0014 to 0.003 @ 10GHz. This offers designers a broad range of products to meet demanding requirements for a variety of designs.AD series PTFEwoven glass based laminates are designed for cost sensitive commercial applications and deliver consistent, high performance required of high frequency PCB materials.

This product series is offered with a dielectric constant range from 2.5 to 10.2, with loss tangent values ranging from 0.0014 to 0.003 @ 10GHz. This offers designers a broad range of products to meet demanding requirements for a variety of designs.Industry leading Dk & Thickness Tolerance for Commercial PTFE Materials
Low Dielectric Loss Tangent
Low Profile Reverse Treat Copper Standard
Lower Z-Direction CTE than Traditional PTFE Woven-Glass Laminates
Available in Dimensions up to 48 x 54

RO4000 dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C, RO4350B , and RO4000 LoPro glass reinforced hydrocarbonceramic laminates have been used in layers where RF microwave frequency, dielectric constant, or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.

The RO4400 prepreg family is comprised of four grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B or RO4000 LoPro laminates.

CuClad 6250 Bonding Film is an ethylene-acrylic acid thermoplastic copolymer. It is recommended for bonding dielectric structures including PTFEGlass (Polytetrafluoroethylene) substrates where exposure to high temperature or high pressure are not desirable.

CuClad 6250 Bonding Film is available in thickness of 0.0015" (0.038 mm).It is supplied in 24 (305mm) roll form and sheeted format.

Important Note: Thermoplastic film with a melt temperature of 213F (101C).

Features

Dielectric Constant 2.32; Loss Tangent 0.0015
Resin Melts at 213F (101C)
Low Pressure Lamination

CuClad 6700 Bonding Film is a chloro-trifluoroethylene (CTFE) thermoplastic copolymer. It is recommended for bonding PTFE (Polytetrafluoroethylene) based substrates in microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.

CuClad 6700 Bonding Film is available in thicknesses of 0.0015" (0.038 mm) and 0.003 (0.076 mm).It is supplied in 24 (610mm) roll form and sheeted format.

Important Note: Thermoplastic film with a melt temperature of 397F (203C).

Features

Dielectric Constant 2.30; Loss Tangent 0.0025
Thermoplastic Resin with Short Dwell Time During Lamination
Low Outgassing
Intrinsic Flame Resistance

Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer. It is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.

3001 bonding film is available in a thickness of 0.0015" (0.038mm), in continuous 12" (305mm) wide rolls, on standard 3" ID (inside diameter) cores.

ULTRALAM 3908 bondply is used as a bonding medium (adhesive layer) between copper and dielectric material and was developed specifically for multi-layer substrate constructions. ULTRALAM 3908 bondply is characterized by low and stable dielectric constant, which is required for high frequency, high-speed products. This product can be used for multilayer constructions with other Rogers ULTRALAM 3000 family of LCP circuit materials such as ULTRALAM 3850 double clad laminate.

ULTRALAM 3908 bondply materials conform to the requirements of IPC 4203TBD. The UL file number is E122972.

2929 Bondply is an unreinforced, thermoset based thin film (available in 1.5, 2, and 3 mil) adhesive system intended for use in high performance, high reliability multi-layer constructions. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer blind via fill capability.