Adhesive Film in USA

• HDPE : 2.3 na 2.2 lbs
• Ultimate Peal from : Loop Tack Shear Peal
• FaceStock (Clear Duralar) : .002"/50um, .005"/125um

Adhesive DuraLar ™ Polyester Film Pressure-sensitive Adhesive DuraLar polyester films combine the high performance of DuraLar polyester film, with a permanent acrylic-based coating on one side, and a 90# stay-flat release liner. The durability of polyester film along with the adhesive makes this film ideal more...

• Total Thickness: : 3.5 mil
• Part Number : CO662

This tape is a polyester film, double coated with an aggressive rubber adhesive. It is ideal for foam fabrication, attaching of decorative trim, splicing printing and coating webs. more...

OVERLAMINATES AND ADHESIVE FILMS Over-laminating and adhesive films are used in printed applications for mounting, laminating and encapsulating. These films are typically available in heat-activated, heat-set and pressure-sensitive varieties. Over-laminates are clear films with adhesive backing that are typic more...

Ultron Systems' Silicone-Free Adhesive Plastic Films contain absolutely NO silicone release agents, resulting in a much cleaner process and more consistent adhesive properties. They share both the same linear elongation properties and uniformity of base film as well as adhesive properties similar to our other more...

Water permeable, breathable, and comfortable Accelerates healing, anti-infection Long-lasting adhesion Hypoallergenic adhesive Available shapes: RECTANGLE, SQUARE AND OVAL Supplied with or without central dressing Size 6x7cm available with IV catheter slo more...

• Quality : High Bond Strength
• Supplied on : PET Carrier

Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks. This approach overcomes voiding and flow issues that can be problematic for sweat soldering and dispensed adhesive approaches. The films can be tack soldered in more...

Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks. This approach overcomes voiding and flow issues that can be problematic for sweat soldering and dispensed adhesive approaches. The films can be tack soldered in more...