Adhesives & Sealants #5144196

United Adhesives' heat cure non-sag (thixotropic) version adhesives and sealants made from high performance silicones and epoxies provide following major features: - Strong bonding to aluminum and most common metals.- Strong bonding to most common plastics.- Thermal stress compliant with silicone adhesives.- Automated dispensable- Non-corrosion sealants and adhesives- Excellent moisture, oil and chemical resistanceThey are used to bond and seal electronic devices, components, electrical equipment, power and control connections, cover plates, housings, etc. The silicone series, Bondseal, provides stress release and resistance to high temperature and humidity. The epoxy series provides strong structural bonding for vibration applications and resistance to oil and chemicals.

United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features: - High thermal conductivity & heat dissipating capacity- High bonding strength to most common plastics and metals- Flexible cure profile. Some are room temperature curable- Automated dispensable and printable- Soft and flexible to couple thermal stress while dissipating heat- High dielectric strength for voltage insulationStructural bonding epoxy based thermally conductive adhesives are also available. Potential Uses For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between high heat power device and heat sink; or any places where require coupling thermal stress while dissipating heat, or require thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.

Features United Adhesives Inc. makes two categories of Electrically Conductive Adhesives (ECA), silver filled silicones (Silductor series) and silver filled epoxies (Eposolder series), in both one-part and two-part systems. They are either dispensable or screen stencil printable. The Eposolder series provides superior bonding strength to most common metalalloy surfaces while maintaining high electrical & thermal conductivity. Potential Uses The typical applications are for mounting of heat sensitive dies or components in sensors, disk drive, flip-chip, die attach assembly or packaging, MEMS, LED Driver IC's, CCD chip attach, wafer lamination, CSP. Epoxy based ECAs provide electrically conductive bonding between components and mounting surfaces, and serve as thermal interface material for conducting heat through heat spreader. They are alternatives for solder replacement, chip bonding, and lead terminations.

United Adhesives Inc. makes high performance epoxy adhesives for electronic structural bonding, severe thermal shock and vibration bonding, and media resistance applications. These include, but not limited to, low viscosity impregnating epoxy, high Tg, low CTE, high thixotropic epoxy, voltage and media resistant epoxies, etc. They have following typical features: - Thixotropic bonding epoxy to anti-sag in processing- High Tg formulation for high temperature stability- Very low CTE formulation to minimize the thermal mismatch- Very soft flexible epoxy formulation offering rubbery flexibility- High voltage insulation formulation- Transparent epoxy for Opto-electronic applicationsSome epoxy adhesives can be used in other industries such as in mediccal applications and in modern constructions.