United Adhesives

Epoxy based underfill and encapsulant products from United Adhesives are for semiconductor applications such as to attach chip-on-board, bare die, BGA, flip-chip, CSP, etc, or to under-fill the gap between die chip and substrate, or to encapsulate dies, chips, components, or powder devices. They provide various superior features such as: - Excellent capillary flow capability. - High Tg formulation for high temperature stability - Very low CTE formulation to minimize the thermal mismatch - High voltage insulation formulation - Strong bond to FR4, ceramic, polyamide, metals, and other materials - Good dielectric property. Low current leakage

United Adhesives Inc. provides innovative solutions for optoelectronics with optical-grade epoxy and silicone encapsulants, coatings, adhesives, and sealants. They are applied in bonding and potting fiber-optic cables, connectors and terminations, LCD backlighting, displays, traffic and other lightings, upgrading the vibration and shock resistance of electro-optic assemblies, cementing and coating optical parts, potting LED devices, optical replications, and coating or encapsulating a wide variety of electro-optic and laser components. They have following outstanding features: - Excellent light transmission characteristics. - Superior non-yellowing properties or anti-yellowing - Silicone based system can cure to low-stress elastomer - Resistance to ozone and UV Degradation - Broad operating at temperatures of -40 to 180°C. - High adhesion, high purity, moisture resistance - Reworkable for silicones.

Conformal coatings from United Adhesives protect electronics and filling voids and cracks. They have excellent moisture and corrosion protection, and resistance to dust and dirt particles. They are very soft and flexible and form “stress-free” coating and encapsulating of electronic components and devices. They are used for coating electronic devices to protect chips, silicon dies, components, and wire bonds. They have following categories and features: - Heat cure silicone coating gels - Heat cure potting gels that provide best protection - Room temp moisture cure. Oven cure not required - Epoxy coating and potting that provides oil & chemical resistance

United Adhesives' heat cure non-sag (thixotropic) version adhesives and sealants made from high performance silicones and epoxies provide following major features: - Strong bonding to aluminum and most common metals. - Strong bonding to most common plastics. - Thermal stress compliant with silicone adhesives. - Automated dispensable - Non-corrosion sealants and adhesives - Excellent moisture, oil and chemical resistance They are used to bond and seal electronic devices, components, electrical equipment, power and control connections, cover plates, housings, etc. The silicone series, Bondseal, provides stress release and resistance to high temperature and humidity. The epoxy series provides strong structural bonding for vibration applications and resistance to oil and chemicals.

Silicone rubber based RTV sealants adhesives from United Adhesives Inc. provide strong bonding to most common plastics and metals with excellent thermal stress release and water resistance. Epoxy based sealants adhesives provide strong structural bonding to most common plastics and metals with strong oil and chemical resistance. Some major features are like this: - Strong bonding to aluminum and most common plastics. - Thermal stress compliant with silicone RTV sealants. - Automated dispensable - Excellent moisture resistance from RTV silicone sealant - Excellent oil and chemical resistance from epoxy RTV They are used to bond and seal electronic devices, components, equipment, connections, cover plates, housings, etc; make formed-in-place gaskets; assemble and repair electronic devices. They can also be applied as general-purpose sealants for other applications.

United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features: - High thermal conductivity & heat dissipating capacity - High bonding strength to most common plastics and metals - Flexible cure profile. Some are room temperature curable - Automated dispensable and printable - Soft and flexible to couple thermal stress while dissipating heat - High dielectric strength for voltage insulation Structural bonding epoxy based thermally conductive adhesives are also available. Potential Uses For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between high heat power device and heat sink; or any places where require coupling thermal stress while dissipating heat, or require thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.