Adhesives & Sealants #4936907

CHO-BOND 1030: CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. CHOBOND 1030s moisture cure silicone polymer system allows it to cure to the touch in 24hrs and provides a robust conductive bond over a wide range of application temperatures. For best adhesion results, CHO-BOND 1030 should be used in conjunction with 1086 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents, windows and electronic enclosures.

CHO-BOND 1075: CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer.

CHO-BOND 1029: CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1029 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). Low volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1029 a good choice for a variety of commercial and military applications. Curing of CHO-BOND 1029 can be achieved in as little as 30 minutes with heat to minimize equipment downtime and increase manufacturing throughput. CHO-BOND 1029 is supplied as a two component system, one part liquid and one part wet powder solid. For optimum mixing and material performance, the sand-like solid part should be added incrementally to the liquid part and mixed slowly over a 10 minute time period. For best adhesion results, CHO-BOND 1029 should be used in conjunction with CHO-SHIELD 1085 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.