Other Products / Services #4936907

Tecknit 0002:TECKNIT 0002 is a silver filled, one component conductive silicone, designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for TECKNIT 0002 is 0.005 inches (0.13 mm). In addition, TECKNIT0002 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (150 psi) is required. TECKNIT 0002s moisture cure silicone polymer system allows it to cureto the touch in 2 hrs and provides a flexible and resilient conductive and environmental seal over a wide range of application temperatures. Care must be taken when using TECKNIT 0002 on sensitive ubstrates as a trace amount of acetic acid is emitted during cure which may damage electrical circuitry. Ventilation may also be required when using TECKNIT 0002 as the acetic acid released during cure emits a strong odor. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

CHO-BOND 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. CHO-BOND 584-29 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)), but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. The fine silver filler of CHO-BOND 584-29 make it a good material choice for precise application in and around tight spaces and electrical components. CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues. Curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.

CHO-BOND Primer 1085 & 1086: Parker Chomerics CHO-BOND primers 1085 and 1086 are air-drying liquid coatings used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates. The primers are moisture reactive and clear in color. CHO-BOND 1085 primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND 1029 adhesive. CHO-BOND 1086 primer is formulated for use with CHO-BOND 1016, 1030, 1035, 1038, 1075 electrically conductive adhesivessealants and CHOTHERM 1641 thermal compound.

Note that typically, the proper primer comes bundled as a kit with the CHO-BOND or CHO-THERM compound ordered. However, if extra primer is deemed necessary, then part numbers for just the primer are provide in the ordering information below

CHO-BOND 1035: CHO-BOND 1035 is a silver-plated glass filled, one component conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures.

For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer.

CHO-BOND Primer 1085 & 1086: Parker Chomerics CHO-BOND primers 1085 and 1086 are air-drying liquid coatings used to improve the adhesion of Parker Chomerics CHO-BOND conductive silicone compounds to metal and other non-silicone substrates. The primers are moisture reactive and clear in color. CHO-BOND 1085 primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND 1029 adhesive. CHO-BOND 1086 primer is formulated for use with CHO-BOND 1016, 1030, 1035, 1038, 1075 electrically conductive adhesivessealants and CHOTHERM 1641 thermal compound.

Note that typically, the proper primer comes bundled as a kit with the CHO-BOND or CHO-THERM compound ordered. However, if extra primer is deemed necessary, then part numbers for just the primer are provide in the ordering information below

CHO-BOND 1035: CHO-BOND 1035 is a silver-plated glass filled, one component conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures.

For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer.