EB-470 is a thermally conductive, high temperature epoxy adhesive specially designed for heat sink attachment. In electronics, heat sinks are passive heat exchangers that cool a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool CPUsmore...
United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features: - High thermal conductivity & heat dissipating capacity - High bonding strength to most common plastics and metalmore...
COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust & lead-free solder compatible Low flow more...